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1.
公开(公告)号:US6090964A
公开(公告)日:2000-07-18
申请号:US233573
申请日:1999-01-19
申请人: Shi-Woo Rhee , Doo-Hwan Cho , Jai-Wook Park , Sang-Woo Kang
发明人: Shi-Woo Rhee , Doo-Hwan Cho , Jai-Wook Park , Sang-Woo Kang
IPC分类号: C07F1/08 , C23C16/18 , H01L21/285
摘要: A liquid organocuprous compound of formula (I) of the present invention can be conveniently used in a low-temperature CVD process for the production of a contaminant-free copper film having good step-coverage and hole-filling properties: ##STR1## wherein: R.sup.1 represents a C.sub.3-8 cycloalkyl group, andR.sup.2 and R.sup.3 are each independently a perfluorinated C.sub.1-4 alkyl group.
摘要翻译: 本发明的式(I)的有机有机化合物可以方便地用于生产具有良好阶梯覆盖和充填孔性能的无污染铜膜的低温CVD工艺中:其中:R1表示 C3-8环烷基,R2和R3各自独立地为全氟化C 1-4烷基。