公开(公告)号：US06885556B2

公开(公告)日：2005-04-26

申请号：US10874232

申请日：2004-06-24

申请人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

发明人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

摘要翻译： 一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器 散热构件和受热构件之间的冷却剂。 该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接， 连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。

公开(公告)号：US20050180108A1

公开(公告)日：2005-08-18

申请号：US11108707

申请日：2005-04-19

申请人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

发明人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic apparatus includes a case mounting a semiconductor element therein, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the case, and a liquid driver which drives a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein and having at least a predetermined volume of the coolant to delimit a coolant surface within the tank. The tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.

摘要翻译： 一种电子设备，包括：将半导体元件安装在其中的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件，以及驱动液体冷却剂 热辐射部件和受热部件。 该装置还包括在其中积聚液体冷却剂的罐，并且具有至少预定体积的冷却剂以限定罐内的冷却剂表面。 容器，散热构件和受热构件与管连接，并且连接到容器中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与位置的变化无关 坦克。

公开(公告)号：US06757169B2

公开(公告)日：2004-06-29

申请号：US10239155

申请日：2003-05-06

申请人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

发明人： Yoshihiro Kondo ,  Shinji Matsushita ,  Shigeo Ohashi ,  Takashi Naganawa ,  Rintaro Minamitani ,  Tsuyoshi Nakagawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an electronic equipment or apparatus, having water-cooling structure able to circulate/supply a cooling liquid with stability, for dealing with an increase of heat-generation of a heat-generating element, accompanying with an increase of processing performances, a pipe, which is located at a side where the cooling water flows out from a tank building up the water-cooling system, is extended up to the position of a center of the tank and disposed therein. Also, two (2) pieces of plates are provided for dividing the vicinity of an inlet portion of a pipe, through which the cooling water flows out, within the tank, and further, when injecting the cooling water into the tank, an injection jig for the cooling water is used, which has a connector portion with the tank.

摘要翻译： 在具有能够稳定地循环/供给冷却液的水冷结构的电子设备或装置中，为了处理发热元件的发热增加，随着加工性能的提高，管， 其位于冷却水从构成水冷却系统的罐流出的一侧，延伸到罐的中心位置并设置在其中。 另外，设置有二（2）个板，用于将在冷却水流出的管的入口附近分配在罐内，此外，当将冷却水注入罐中时，注射夹具 因为使用冷却水，其具有与罐的连接器部分。

公开(公告)号：US20050078450A1

公开(公告)日：2005-04-14

申请号：US10968010

申请日：2004-10-20

申请人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

IPC分类号： F25D17/02 ,  F28F1/22 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  F28F1/22 ,  G06F2200/201 ,  G06F2200/203

摘要： A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.

摘要翻译： 一种用于冷却电子设备内的发热元件的水冷装置。 水冷装置包括可与发热元件热连接的水冷套，散热管，罐和液体驱动器，其形成冷却液流过的循环流路。 水冷套，散热管，罐和液体驱动器中的至少一个安装在板上，并且水冷装置通过板相对于发热元件可拆卸。

公开(公告)号：US06809927B2

公开(公告)日：2004-10-26

申请号：US10239141

申请日：2003-05-09

申请人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Hajime Katou ,  Tsuyoshi Nakagawa

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  F28F1/22 ,  G06F2200/201 ,  G06F2200/203

摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is conducted through circulation of a liquid, in particular, for providing a liquid-cooling structure of being high in reliability, while also considering safety and assembling property into the consideration, wherein a water-cooling jacket 8 is thermally connected with a heat-generating element 7, while thermally connecting a heat-radiation pipe 9 with a heat-radiation plate 10 provided on a rear surface of a display 2, wherein a coolant liquid is circulated between the water-cooling jacket 8 and the heat-radiation pipe 9, by means of a liquid driving device 11. The heat-radiation pipe 9 is connected onto a whole area of the heat-radiation plate, like crawling thereupon. A tank 14 is provided in an upper portion of the heat-radiation plate 10, and is connected with the heat-radiation pipe 9.

摘要翻译： 在通过液体循环进行发热元件的冷却的电子设备的结构中，特别是用于提供可靠性高的液冷结构，同时考虑到安全性和组装性能 考虑到其中水冷套8与发热元件7热连接，同时将热辐射管9与设置在显示器2的后表面上的散热板10热连接，其中冷却剂液体 通过液体驱动装置11在水冷套管8和散热管9之间循环。散热管9连接到散热板的整个区域上，就像在其上爬行一样。 在散热板10的上部设有槽14，与散热管9连接。

公开(公告)号：US20050007730A1

公开(公告)日：2005-01-13

申请号：US10239156

申请日：2002-07-10

申请人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa

发明人： Shigeo Ohashi ,  Yoshihiro Kondo ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  G06F1/203 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

摘要： In the structure of an electronic apparatus, in which cooling of an heat-generating element is achieved through circulation of a liquid, in particular, for providing the structure of being high in cooling performance and reliability, wherein a heat-radiation pipe 9 is connected to a heat-radiation plate 10 disposed in a rear surface of a display 2, while thermally connecting a water-cooling jacket 8 with the heat-generating element 7, thereby circulating a coolant liquid between the water-cooling jacket 8 and the heat-radiation pipe 9 by means of a liquid driving device 11. The water-cooling jacket 8 can be formed in one body of a jacket base and a flow passage therein through the die-cast forming thereof, or can be constructed in one body with the water-cooling jacket and the flow passage of piping, through connection between the jacket base and the metal pipe.

摘要翻译： 在通过液体循环实现发热元件的冷却的电子设备的结构中，特别是为了提供冷却性能和可靠性高的结构，其中连接有散热管9 到设置在显示器2的后表面中的散热板10，同时将水冷套8与发热元件7热连接，从而使冷却液在水冷套8和热水套8之间循环。 辐射管9通过液体驱动装置11形成。水冷套8可以通过其压铸成型形成在套管基体的一个主体和流动通道中，或者可以在一个主体中与 水冷套管和管道的通道，通过护套底座和金属管之间的连接。

公开(公告)号：US06807056B2

公开(公告)日：2004-10-19

申请号：US10621647

申请日：2003-07-18

申请人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

发明人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

IPC分类号： H05K720

CPC分类号： H05K7/20781 ,  G06F1/20 ,  G06F2200/201

摘要： A plurality of electronic apparatuses, each apparatus having a closed loop cooling system, are installed in a cabinet having another closed loop fluid cooling system. Each of the closed loop fluid cooling systems includes a heat receiver and a pump. A projection is mounted on the electronic apparatus and a switching valve is arranged on the cabinet to stop or start circulation of a cooling fluid.

公开(公告)号：US20050082036A1

公开(公告)日：2005-04-21

申请号：US10968059

申请日：2004-10-20

申请人： Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Yuji Yoshitomi ,  Takashi Naganawa ,  Masato Nakanishi ,  Tsuyoshi Nakagawa

发明人： Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Yuji Yoshitomi ,  Takashi Naganawa ,  Masato Nakanishi ,  Tsuyoshi Nakagawa

IPC分类号： G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  F28D15/0266 ,  G06F2200/201

摘要： A cooling device for an electronic apparatus includes a heat generating element attached within a housing, a heat receiving jacket connectable with the heat generating element, a heat exchanger for exchanging heat between the heat receiving jacket and outside of the electronic apparatus and a liquid driver which supplies a cooling liquid to the heat receiving jacket. A part of pipework connected between the heat receiving jacket, the heat exchanger, and the liquid driver is made of a flexible tube of resin, and an ion exchanger is provided in a portion of the pipework. The cooling liquid has a corrosion inhibitor therein.

摘要翻译： 一种用于电子设备的冷却装置，包括附接在壳体内的发热元件，可与发热元件连接的热接收护套，用于在热接收护套和电子设备外部之间进行热交换的热交换器，以及液体驱动器 向冷却液供应冷却液。 连接在热接收套管，热交换器和液体驱动器之间的管道的一部分由柔性的树脂管制成，并且在管道的一部分中提供离子交换器。 冷却液中含有腐蚀抑制剂。

公开(公告)号：US20050047083A1

公开(公告)日：2005-03-03

申请号：US10962472

申请日：2004-10-13

申请人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

发明人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20781 ,  G06F1/20 ,  G06F2200/201

摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。

公开(公告)号：US07050299B2

公开(公告)日：2006-05-23

申请号：US10962472

申请日：2004-10-13

申请人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

发明人： Yoshihiro Kondo ,  Shigeo Ohashi ,  Rintaro Minamitani ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Masato Nakanishi ,  Yasuhiko Sasaki ,  Tsuyoshi Nakagawa ,  Osamu Suzuki ,  Shinji Matsushita ,  Yasunori Yamada

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  G06F1/20 ,  G06F2200/201

摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.

摘要翻译： 一种可拆卸地安装在电子设备上的电子模块。 电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。 冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。