公开(公告)号：US06321600B1

公开(公告)日：2001-11-27

申请号：US09360549

申请日：1999-07-26

申请人： Shigeru Hirose ,  Masato Ando ,  Yoshiyuki Nakamizo ,  Takeshi Arikura ,  Tsutomu Sawai

发明人： Shigeru Hirose ,  Masato Ando ,  Yoshiyuki Nakamizo ,  Takeshi Arikura ,  Tsutomu Sawai

IPC分类号： G01P1509

CPC分类号： G01P15/18 ,  G01P15/0922 ,  G01P2015/084

摘要： An acceleration detecting device capable of permitting a weight, a diaphragm and a base to be precisely positioned on a casing of a measuring equipment or the like. The weight, diaphragm and base are integrally formed of a metal material into a single unit. An insulating casing is integrally formed while incorporating the single unit as an insert therein. The insulating casing has a recess defined by a side wall thereof, which is formed with a window for exposing a part of the base therethrough. The recess of the casing is closed with a metal cover member, which is mounted on the casing. The cover member is integrally provided with a contactor which is elastically forced against the base through the window. The base is electrically connected to ground terminals of terminal fitments.

摘要翻译： 一种加速度检测装置，其能够使重量，隔膜和基座精确地定位在测量设备等的壳体上。 重量，隔膜和底座由金属材料整体形成为一个单元。 绝缘壳体一体形成，同时将单个单元作为插入件并入其中。 绝缘壳体具有由其侧壁限定的凹部，其形成有用于使基部的一部分暴露于其中的窗口。 壳体的凹部用安装在壳体上的金属盖构件封闭。 盖构件一体地设置有接触器，该接触器通过窗口弹性地抵靠基部。 基座电气连接到端子配件的接地端子。

公开(公告)号：US07122396B2

公开(公告)日：2006-10-17

申请号：US10530341

申请日：2003-10-03

申请人： Yoshiyuki Nakamizo ,  Tsutomu Sawai ,  Masato Ando

发明人： Yoshiyuki Nakamizo ,  Tsutomu Sawai ,  Masato Ando

IPC分类号： H01L21/00 ,  H01L21/20

CPC分类号： G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084

摘要： The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located. A stopper structure is constituted by the inclined surfaces 13 and the abutting portion 3d of the weight 3, for restricting a displacement range of the weight 3 in the direction where the diaphragm portion 11 is located.

摘要翻译： 本发明提供一种半导体加速度传感器，其中即使当至少部分重量设置在半导体传感器元件的内部空间中并且相应地增加了重量时，也可以防止半导体元件损坏。 支撑部分9的内圆周表面由四个梯形倾斜表面13构成，其大体上相同的形状被环形地组合，以限定截头锥体空间的外周表面。 重物3被构造成具有邻接部分，该邻接部分包括直线部分3d，该直线部分3d在重量3沿着隔膜部分的方向发生最大位移时抵靠构成支撑部分9的内周面的倾斜表面13 11位于。 抵接部3d从配重固定部7的一侧观察时呈圆形的轮廓形状。 挡块结构由重物3的倾斜面13和抵接部3d构成，用于限制重量3在隔膜部11的方向上的位移范围。

公开(公告)号：US20060094148A1

公开(公告)日：2006-05-04

申请号：US10530341

申请日：2003-10-03

申请人： Yoshiyuki Nakamizo ,  Tsutomu Sawai ,  Masato Ando

发明人： Yoshiyuki Nakamizo ,  Tsutomu Sawai ,  Masato Ando

IPC分类号： H01L21/00

CPC分类号： G01P15/0802 ,  G01P15/123 ,  G01P15/18 ,  G01P2015/084

摘要： The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located. A stopper structure is constituted by the inclined surfaces 13 and the abutting portion 3d of the weight 3, for restricting a displacement range of the weight 3 in the direction where the diaphragm portion 11 is located.

公开(公告)号：US20110117689A1

公开(公告)日：2011-05-19

申请号：US13012172

申请日：2011-01-24

申请人： Tsutomu Sawai ,  Kazuya Komori

发明人： Tsutomu Sawai ,  Kazuya Komori

IPC分类号： H01L21/302

CPC分类号： G01P15/0802 ,  G01L9/0042 ,  G01P15/123 ,  H01L29/84

摘要： A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

摘要翻译： 提供其厚度可以减小的半导体传感器和制造用于半导体传感器的传感器体的方法。 在中心线C的延伸方向上测量的重量部分5和附加重量部分3的总长度L1被确定为比沿着中心线C的延伸方向测量的支撑部分7的长度L2短。 重物部分5和附加重量部分3被容纳在由支撑部分7包围的空间15内。然后，确定重量部分5和附加重量部分3的尺寸和形状，以使重量部分5 并且附加重量部分3在空间15内移动。

公开(公告)号：US20090289315A1

公开(公告)日：2009-11-26

申请号：US12158138

申请日：2006-12-20

申请人： Tsutomu Sawai ,  Komori Kazuya

发明人： Tsutomu Sawai ,  Komori Kazuya

IPC分类号： H01L29/84 ,  H01L21/302

CPC分类号： G01P15/0802 ,  G01L9/0042 ,  G01P15/123 ,  H01L29/84

摘要： A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

摘要翻译： 提供其厚度可以减小的半导体传感器和制造用于半导体传感器的传感器体的方法。 在中心线C的延伸方向上测量的重量部分5和附加重量部分3的总长度L1被确定为比沿着中心线C的延伸方向测量的支撑部分7的长度L2短。 重物部分5和附加重量部分3被容纳在由支撑部分7包围的空间15内。然后，确定重量部分5和附加重量部分3的尺寸和形状，以允许重物部分5 并且附加重量部分3在空间15内移动。

公开(公告)号：US08173472B2

公开(公告)日：2012-05-08

申请号：US13012172

申请日：2011-01-24

申请人： Tsutomu Sawai ,  Kazuya Komori

发明人： Tsutomu Sawai ,  Kazuya Komori

IPC分类号： H01L21/00

CPC分类号： G01P15/0802 ,  G01L9/0042 ,  G01P15/123 ,  H01L29/84

摘要： A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

摘要翻译： 提供其厚度可以减小的半导体传感器和制造用于半导体传感器的传感器体的方法。 在中心线C的延伸方向上测量的重量部分5和附加重量部分3的总长度L1被确定为比沿着中心线C的延伸方向测量的支撑部分7的长度L2短。 重物部分5和附加重量部分3被容纳在由支撑部分7包围的空间15内。然后，确定重量部分5和附加重量部分3的尺寸和形状，以允许重物部分5 并且附加重量部分3在空间15内移动。