公开(公告)号：US20110053479A1

公开(公告)日：2011-03-03

申请号：US12811037

申请日：2008-05-19

申请人： Shin Kyung Kim ,  Kee Jung Cheong ,  Brian Song ,  Tae Jin Kim ,  Mun Seak Park ,  Byung Ju Min ,  Jeong Bin Jeon

发明人： Shin Kyung Kim ,  Kee Jung Cheong ,  Brian Song ,  Tae Jin Kim ,  Mun Seak Park ,  Byung Ju Min ,  Jeong Bin Jeon

IPC分类号： B24D7/06 ,  B24D18/00

CPC分类号： B24D7/06

摘要： A method of manufacturing a cutting tool is disclosed. An object of the manufacturing method of a cutting tool is to reduce contamination of an abrasive layer surface, particularly, agglomeration contamination due to slurry by improving hydrophobicity maintaining performance of an abrasive layer. A cutting tool according to the method of manufacturing comprises an abrasive layer on a base member, the abrasive layer having abrasives bonded to a surface thereof; and a coating on the surface of the abrasive layer that is a hydrophobic material film.

摘要翻译： 公开了一种制造切削工具的方法。 切削工具的制造方法的一个目的是减少研磨层表面的污染，特别是由于通过改善研磨层的疏水性维持性而引起的浆料污染。 根据制造方法的切削工具包括在基底构件上的研磨层，所述研磨层具有结合到其表面的研磨剂; 以及作为疏水材料膜的研磨层表面上的涂层。

公开(公告)号：US20130225052A1

公开(公告)日：2013-08-29

申请号：US13822275

申请日：2011-08-11

申请人： Jun Ho Song ,  Mun Seak Park ,  Shin Kyung Kim ,  Young Hwan Kim ,  Hyun Woo Lee

发明人： Jun Ho Song ,  Mun Seak Park ,  Shin Kyung Kim ,  Young Hwan Kim ,  Hyun Woo Lee

IPC分类号： B24B53/017

CPC分类号： B24B53/017

摘要： Provided is a chemical mechanical polishing pad conditioner including a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy. The plurality of protrusions may be formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof. The chemical mechanical polishing pad conditioner further includes a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several μm are formed.

摘要翻译： 本发明提供一种化学机械抛光垫调节剂，其包括在至少一个表面上形成有由陶瓷或硬质合金制成的多个突起的基板。 多个突起可以通过激光加工形成，以便在其上端和倾斜侧上不具有成角度的边缘。 化学机械抛光垫调节剂还包括沉积以覆盖多个突起的金刚石薄膜，其中金刚石薄膜包括粗糙抛光表面，在其上形成具有几个微小尺寸的微突起。

公开(公告)号：US07128066B2

公开(公告)日：2006-10-31

申请号：US11118165

申请日：2005-04-28

申请人： Hwan Chul Lee ,  Seo Pong Pyun ,  Sang Do Lee ,  Byung Lyul Jin ,  Sang Jin Lee ,  Tae Ung Um ,  Yong Seob Shim ,  Shin Kyung Kim

发明人： Hwan Chul Lee ,  Seo Pong Pyun ,  Sang Do Lee ,  Byung Lyul Jin ,  Sang Jin Lee ,  Tae Ung Um ,  Yong Seob Shim ,  Shin Kyung Kim

IPC分类号： B28D1/12

CPC分类号： B23D61/04 ,  B28D1/121 ,  Y10T407/26

摘要： Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.

摘要翻译： 公开了一种金刚石工具，其中插入有金属板。 在含有金刚石颗粒的研磨层之间插入耐磨性低于研磨层的耐磨性的铁或非铁金属板，使得在切割过程中自发形成凹槽，从而减少与工件的接触载荷 避免柄的振动（摆动），并且提供用于平滑地去除切屑和冷却水的排出路径。 此外，研磨剂的含量和接合材料的耐磨性均匀地构成，使得在烧结期间不需要考虑收缩率，并且可以简化制造过程，从而降低制造成本并提高其生产率。 此外，可以控制金属板的面积，从而能够使与工件的工作条件相一致的简单设计。

公开(公告)号：US20100043304A1

公开(公告)日：2010-02-25

申请号：US12524349

申请日：2007-04-23

申请人： Hyun Woo Lee ,  Jong Hwan Park ,  Sung Kun Lee ,  Shin Kyung Kim

发明人： Hyun Woo Lee ,  Jong Hwan Park ,  Sung Kun Lee ,  Shin Kyung Kim

IPC分类号： B23P5/00 ,  B24D3/04

CPC分类号： B28D1/121 ,  B22F2998/10 ,  B23D65/00 ,  C22C26/00 ,  B22F3/225 ,  B22F7/062 ,  B22F3/1021

摘要： Disclosed herein is a diamond tool and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank having a compact having a plurality of grooves, and diamond particles inserted into the grooves and bonded to the compact. The grooves can be formed on the compact corresponding to a desired arrangement locations of the diamond particles. A metal powder injection molding method can be employed to prepare the compacts. More than one compact can be stacked to form the segment, so that the diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows cost savings and process automation.

摘要翻译： 本文公开了一种金刚石工具及其制造方法。 金刚石工具包括柄部和联接到柄部的节段，其具有具有多个凹槽的致密体，并且金刚石颗粒插入到凹槽中并结合到压块。 可以在对应于金刚石颗粒的所需布置位置的压块上形成凹槽。 可以使用金属粉末注射成型方法来制备压块。 可以堆叠多个压块以形成段，使得金刚石颗粒可以在段中以各种图案布置，从而实现工艺的简化，这允许成本节省和过程自动化。

公开(公告)号：US20100048112A1

公开(公告)日：2010-02-25

申请号：US12524552

申请日：2007-04-23

申请人： Hyun Woo Lee ,  Jong Hwan Park ,  Shin Kyung Kim ,  Dae Geun Kim

发明人： Hyun Woo Lee ,  Jong Hwan Park ,  Shin Kyung Kim ,  Dae Geun Kim

IPC分类号： B23P5/00 ,  B24D7/06 ,  B24D3/04

CPC分类号： B23D61/04 ,  B23D65/00

摘要： Disclosed herein is a diamond tool for cutting a workpiece and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank. The segment includes a tape having a plurality of inserting sections formed on a surface of the tape, and diamond particles inserted into the inserting sections and bonded to the tape by pressure sintering. The inserting sections are formed in the tape corresponding to desired arrangement locations of the diamond particles. The diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows process automation and reduces manufacturing costs.

摘要翻译： 本文公开了一种用于切割工件的金刚石工具及其制造方法。 金刚石工具包括柄和连接到柄的段。 所述片段包括具有形成在所述带的表面上的多个插入部分的带和插入到所述插入部分中的金刚石颗粒，并通过加压烧结结合到所述带上。 插入部分形成在磁带中，对应于金刚石颗粒的所需布置位置。 金刚石颗粒可以以片段中的各种图案布置，从而实现了工艺的简化，这允许工艺自动化并降低制造成本。