公开(公告)号：US6152679A

公开(公告)日：2000-11-28

申请号：US264996

申请日：1999-03-09

申请人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

发明人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

IPC分类号： H05K13/04 ,  H01R43/00

CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably hold a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

摘要翻译： 一种芯片安装装置，其能够以更高的速度进行芯片安装操作，并且确保设备在长时间内的连续运行。 该装置包括安装在芯片安装头侧的芯片观察摄像机，安装在芯片安装头侧的照明单元，以照亮保持在头部的芯片吸嘴上的芯片的背景;安装 在芯片安装头的一侧，将芯片的图像输入到芯片观察摄像机，馈送器和储片器部分，每个适配器可更换地保持其中的芯片存储包装;以及封装更换机构，用于执行芯片存储封装 两部分之间。

公开(公告)号：US5878484A

公开(公告)日：1999-03-09

申请号：US631827

申请日：1995-12-28

申请人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

发明人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

摘要翻译： 一种芯片安装装置，其能够以更高的速度进行芯片安装操作，并且确保设备在长时间内的连续运行。 该装置包括安装在芯片安装头侧的芯片观察摄像机，安装在芯片安装头侧的照明单元，以照亮保持在头部的芯片吸嘴上的芯片的背景;安装 在芯片安装头的侧面，将芯片的图像输入到芯片观察摄像机，馈送器和储片器部分，每个适配器可更换地保持其中的芯片存储包装;以及封装更换机构，用于执行芯片存储封装 两部分之间。

公开(公告)号：US06435808B1

公开(公告)日：2002-08-20

申请号：US09722907

申请日：2000-11-27

申请人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

发明人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

IPC分类号： B65G1133

CPC分类号： H05K13/0812

摘要： A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip hold on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

摘要翻译： 一种芯片安装装置，其能够以更高的速度进行芯片安装操作，并且确保设备在长时间内的连续运行。 该装置包括安装在芯片安装头侧的芯片观察摄像机，安装在芯片安装头一侧的照明单元，以照亮头部的芯片吸嘴上的芯片保持器的背景，安装有反射单元 在芯片安装头的侧面，将芯片的图像输入到芯片观察摄像机，馈送器和储片器部分，每个适配器可更换地保持其中的芯片存储包装;以及封装更换机构，用于执行芯片存储封装 两部分之间。