公开(公告)号：US20110205706A1

公开(公告)日：2011-08-25

申请号：US12854503

申请日：2010-08-11

申请人： Shinji HIGASHIBATA ,  Shozo Kanzaki ,  Hiroyoshi Nishizaki ,  Fumiaki Arimai ,  Mikihiko Suzuki

发明人： Shinji HIGASHIBATA ,  Shozo Kanzaki ,  Hiroyoshi Nishizaki ,  Fumiaki Arimai ,  Mikihiko Suzuki

IPC分类号： H05K7/20 ,  H05K1/14

CPC分类号： B60R16/0239 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3677 ,  H01L23/473 ,  H01L23/49531 ,  H01L23/49575 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K5/065 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (30A) and a second electronic board (40A) bonded onto an upper surface and a lower surface of each of a pair of separate beam members (20A) includes two surfaces on which outer circuit components (31, 32, 41, 42) and an inner circuit component (33, 43) are respectively mounted. A height of each of the inner circuit components is equal to or less than a thickness of each of the separate beam members (20A). Heat-generating components (32, 42) in the outer circuit components are provided to be adjacent to and opposed to the separate beam members (20A).

公开(公告)号：US20110317389A1

公开(公告)日：2011-12-29

申请号：US12970124

申请日：2010-12-16

申请人： Shinji HIGASHIBATA ,  Shozo KANZAKI ,  Hiroyoshi NISHIZAKI ,  Fumiaki ARIMAI

发明人： Shinji HIGASHIBATA ,  Shozo KANZAKI ,  Hiroyoshi NISHIZAKI ,  Fumiaki ARIMAI

IPC分类号： H05K7/14 ,  B29C45/14

CPC分类号： H01L23/49531 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49575 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/14 ,  H05K2201/042 ,  H05K2201/2036 ,  H05K2203/049 ,  H05K2203/1316 ,  H05K2203/1327 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.

摘要翻译： 本发明提供一种具有缩小的面积和体积的小型树脂密封电子控制装置，其可以在不增加电子板的平面面积的情况下提供安装电路部件的放大区域。 在树脂密封电子控制装置中，支撑构件（20A）包括第一支撑板（21a），第二支撑板（22a）和一对形成具有第一电子部件 板（30A）和第二电子板（40A）。 通过将熔化的合成树脂注入空间部分并沿着一对上升部分（23a）在空间部分的外部空间形成外部覆盖材料（11）。 内部电路部件（33）位于通过支撑板（20A）形成的窗孔内，并且面对彼此相对的第一电子基板（30A）和第二电子基板（40A）中的一个，并且间隔开。