摘要:
A vehicle-mounted electronic control apparatus can perform a variety of abnormality detections while reducing the control load of a microprocessor in the abnormality detection of a volatile backup memory that is backed up by an on-board battery. The apparatus includes a control CPU which is fed with power from a main power supply circuit upon closure of a power switch, a nonvolatile control memory and a backup memory. Even if the power switch is opened, the backup memory, being a partial area of a RAM memory, is fed with power through an auxiliary power supply circuit connected directly to the battery. When the battery is replaced with a new one and connected again, a power supply interruption monitoring memory is reset. At the start of operation of the control CPU, the backup memory is initialized based on reset information, and the power supply interruption monitoring memory is rewritten into a set state.
摘要:
A vehicle-mounted electronic control apparatus can perform a variety of abnormality detections while reducing the control load of a microprocessor in the abnormality detection of a volatile backup memory that is backed up by an on-board battery. The apparatus includes a control CPU which is fed with power from a main power supply circuit upon closure of a power switch, a nonvolatile control memory and a backup memory. Even if the power switch is opened, the backup memory, being a partial area of a RAM memory, is fed with power through an auxiliary power supply circuit connected directly to the battery. When the battery is replaced with a new one and connected again, a power supply interruption monitoring memory is reset. At the start of operation of the control CPU, the backup memory is initialized based on reset information, and the power supply interruption monitoring memory is rewritten into a set state.
摘要:
Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (30A) and a second electronic board (40A) respectively bonded onto an upper surface and a lower surface of a support plate (20A) include outer circuit components (31, 41) and inner circuit components (33, 43) respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components (33, 43) are fitted into a window hole portion (21) of the support plate (20A) and are sealed with a filler (25).
摘要:
Provided is an on-vehicle electronic control device with low cost and low power consumption for performing monitoring control in both a driving mode and a parking mode of a vehicle. A main CPU is supplied with electric power from an on-vehicle battery via a power switching element and a main power supply circuit so as to control a plurality of electric loads in accordance with operating states of a plurality of input sensors. A sub CPU connected to the main CPU via a serial interface is supplied with electric power from the on-vehicle battery via a sub power supply circuit so as to monitor operations of the main CPU and input signals. The sub CPU has low speed and small memory capacity so as to operate with lower power consumption compared with the main CPU.
摘要:
Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (30A) and a second electronic board (40A) bonded onto an upper surface and a lower surface of each of a pair of separate beam members (20A) includes two surfaces on which outer circuit components (31, 32, 41, 42) and an inner circuit component (33, 43) are respectively mounted. A height of each of the inner circuit components is equal to or less than a thickness of each of the separate beam members (20A). Heat-generating components (32, 42) in the outer circuit components are provided to be adjacent to and opposed to the separate beam members (20A).
摘要:
A standard characteristic which is an average characteristic of multiple samples is approximated in a polygonal-line fashion by first to third lines. The coordinate-point positions of the first and second lines at comparison adjustment points are stored as standard data in a data memory of an electronic control apparatus. An actual-product characteristic as a calibration target is approximated in a polygonal-line fashion by first to third lines. The resistance value of a label resistor is adjusted to a value corresponding to ratios of monitoring outputs. The electronic control apparatus reads the resistance values of one or two label resistors, combines them with the stored standard characteristic, and interpolates a third line portion, thereby restoring and generating the actual-product characteristic.
摘要:
A standard characteristic which is an average characteristic of multiple samples is approximated in a polygonal-line fashion by first to third lines 315a, 325a, and 335a. The coordinate-point positions of the first and second lines at comparison adjustment points are stored as standard data in a data memory of an electronic control apparatus. An actual-product characteristic as a calibration target is approximated in a polygonal-line fashion by first to third lines 315b, 325b, and 335b. The resistance value of a first label resistor is adjusted to a value corresponding to ratios (V10n/V10, V20n/V20) of monitoring outputs. The resistance value of a second label resistor is adjusted to a value corresponding to ratios (V30n/V30, V40n/V40) of monitoring outputs. The electronic control apparatus reads the resistance values of the label resistors, combines them with the stored standard characteristic, and interpolates a third line portion, thereby restoring and generating the actual-product characteristic.
摘要:
Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.
摘要:
Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board (30A) and a second electronic board (40A) bonded onto an upper surface and a lower surface of each of a pair of separate beam members (20A) includes two surfaces on which outer circuit components (31, 32, 41, 42) and an inner circuit component (33, 43) are respectively mounted. A height of each of the inner circuit components is equal to or less than a thickness of each of the separate beam members (20A). Heat-generating components (32, 42) in the outer circuit components are provided to be adjacent to and opposed to the separate beam members (20A).
摘要:
Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.