公开(公告)号：US20110151625A1

公开(公告)日：2011-06-23

申请号：US12974620

申请日：2010-12-21

申请人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

发明人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

IPC分类号： H01L21/50 ,  B32B7/12

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

摘要翻译： 本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。 由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。 如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。 另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接 。 为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。 粘合片包括基材层和粘合剂层。 粘合剂层具有特定的粘合强度和剥离强度。