公开(公告)号：US20110151625A1

公开(公告)日：2011-06-23

申请号：US12974620

申请日：2010-12-21

申请人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

发明人： Shinji HOSHINO ,  Yukio ARIMITSU ,  Kazuyuki KIUCHI ,  Akihisa MURATA

IPC分类号： H01L21/50 ,  B32B7/12

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/287 ,  H01L2924/00

摘要： The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

摘要翻译： 本发明旨在解决使用粘合片作为临时固定支撑件制造无基底半导体封装的方法的以下问题。 由于芯片没有被粘合片正确地夹持，所以在树脂封装期间，芯片可以通过压力从指定位置移位。 如果发生这种位移，则芯片与在后续布线步骤中连接到指定位置的互连件之间的相对位置关系也随着芯片从指定位置的位移而改变。 另一个问题是如果在粘合片剥离期间发生粘合剂沉积，并且包装表面被粘合剂沉积物污染，残留在芯片表面上的粘合剂组分可以在随后的布线步骤中阻止互连和芯片之间的连接 。 为了解决这些问题，本发明提供了一种用于半导体器件制造的粘合片，其在芯片被树脂封装时附接到无基底半导体芯片。 粘合片包括基材层和粘合剂层。 粘合剂层具有特定的粘合强度和剥离强度。

公开(公告)号：US20080038540A1

公开(公告)日：2008-02-14

申请号：US11838261

申请日：2007-08-14

申请人： Takamasa HIRAYAMA ,  Kazuyuki KIUCHI ,  Masaaki SATO ,  Yukio ARIMITSU ,  Daisuke SHIMOKAWA ,  Tomoko KISHIMOTO

发明人： Takamasa HIRAYAMA ,  Kazuyuki KIUCHI ,  Masaaki SATO ,  Yukio ARIMITSU ,  Daisuke SHIMOKAWA ,  Tomoko KISHIMOTO

IPC分类号： B32B5/16 ,  B05D5/10 ,  B26D7/08

CPC分类号： H01L21/6836 ,  C08K7/22 ,  C09J7/29 ,  C09J7/385 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2205/11 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10T83/0405 ,  Y10T428/25

摘要： The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

摘要翻译： 本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10至38μm， 并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。 本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。

公开(公告)号：US20130237017A1

公开(公告)日：2013-09-12

申请号：US13415217

申请日：2012-03-08

申请人： Hiroyuki KONDO ,  Shinji HOSHINO ,  Yukio ARIMITSU ,  Akinori NISHIO

发明人： Hiroyuki KONDO ,  Shinji HOSHINO ,  Yukio ARIMITSU ,  Akinori NISHIO

IPC分类号： H01L21/50 ,  B32B5/00 ,  B32B33/00 ,  B32B7/02 ,  C09J143/04 ,  C09J133/08 ,  C09J7/02 ,  C09J121/00

CPC分类号： B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/51 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/22 ,  C09J133/02 ,  C09J133/08 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/568 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/78251 ,  H01L2224/78744 ,  H01L2224/83001 ,  H01L2224/83862 ,  H01L2224/85001 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  Y10T428/1476 ,  Y10T428/2495 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00 ,  C08F2220/1825 ,  C08F220/06

摘要： The present invention provides a pressure-sensitive adhesive tape for resin encapsulation in production of a resin encapsulation type semiconductor device, which includes a base material layer which does not have a glass transition temperature in a temperature region of 260° C. or lower and a pressure-sensitive adhesive layer laminated on the base material layer, and a method for producing a resin encapsulation type semiconductor device using the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape according to the present invention highly prevents resin leakage even under severe conditions as in MAP-QFN production process, does not affect certainty of wire bonding and has excellent peelability after resin encapsulation.

摘要翻译： 本发明提供一种树脂封装型半导体装置的制造中的树脂封装用粘合带，该粘合带包括在260℃以下的温度区域中不具有玻璃化转变温度的基材层， 层压在基材层上的压敏粘合层，以及使用该粘合带的树脂封装型半导体装置的制造方法。 根据本发明的压敏粘合带，即使在MAP-QFN制造工艺中的严酷条件下也能够很好地防止树脂的渗漏，不影响引线接合的确定性，并且在树脂封装后具有优异的剥离性。

公开(公告)号：US20100224316A1

公开(公告)日：2010-09-09

申请号：US12716306

申请日：2010-03-03

申请人： Kazuki SOEJIMA ,  Takamasa HIRAYAMA ,  Daisuke SHIMOKAWA ,  Masaaki SATO ,  Yukio ARIMITSU

发明人： Kazuki SOEJIMA ,  Takamasa HIRAYAMA ,  Daisuke SHIMOKAWA ,  Masaaki SATO ,  Yukio ARIMITSU

IPC分类号： B32B38/10 ,  C09J7/02 ,  B32B5/00

CPC分类号： H01G4/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2205/302 ,  C09J2433/00 ,  C09J2467/006 ,  H01G4/308 ,  Y10T156/1052 ,  Y10T428/14 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2852 ,  Y10T428/31504

摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.

摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％ 以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。

公开(公告)号：US20130244377A1

公开(公告)日：2013-09-19

申请号：US13418762

申请日：2012-03-13

申请人： Yukio ARIMITSU

发明人： Yukio ARIMITSU

IPC分类号： H01L21/56 ,  B32B7/12

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6836 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/181 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00

摘要： The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, which includes a base material layer having a glass transition temperature exceeding 180° C., and a pressure-sensitive adhesive layer having an elastic modulus at 180° C. of 1.0×105 Pa or more, which is formed on one side or both sides of the base material layer. The heat-resistant pressure-sensitive adhesive tape of the present invention can be used for temporarily fixing a chip in a production method of a substrateless semiconductor package which does not use a metal frame (for example, a production method of WLP).

摘要翻译： 本发明提供了一种用于制造半导体器件的耐热粘合带，其包括玻璃化转变温度超过180℃的基材层和具有弹性模量的压敏粘合剂层 180℃为1.0×10 5 Pa以上，其形成在基材层的一侧或两侧。 本发明的耐热粘合带可以用于在不使用金属框架的基底无铅半导体封装的制造方法（例如，WLP的制造方法）中临时固定芯片。

公开(公告)号：US20100215882A1

公开(公告)日：2010-08-26

申请号：US12709904

申请日：2010-02-22

申请人： Yuichiro YANAGI ,  Daisuke SHIMOKAWA ,  Yukio ARIMITSU

发明人： Yuichiro YANAGI ,  Daisuke SHIMOKAWA ,  Yukio ARIMITSU

IPC分类号： B32B7/10 ,  B32B38/10

CPC分类号： C09J133/08 ,  C08L33/064 ,  C08L33/08 ,  C09J5/00 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2205/302 ,  C09J2400/123 ,  C09J2433/00 ,  Y10T156/108 ,  Y10T428/1452

摘要： The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350 mg-KOH/g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80 mg-KOH/g or less.

摘要翻译： 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂，发泡剂和增粘树脂的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的凝胶分数为 50重量％以上，形成热膨胀性压敏粘合剂层的压敏粘合剂的基础聚合物的酸值为350mg-KOH / g以下，并且增粘树脂包含在热膨胀性粘合剂层中 压敏粘合剂层的酸值为80mg-KOH / g以下。

公开(公告)号：US20120223455A1

公开(公告)日：2012-09-06

申请号：US13411365

申请日：2012-03-02

申请人： Toshio SHINTANI ,  Yukio ARIMITSU

发明人： Toshio SHINTANI ,  Yukio ARIMITSU

IPC分类号： B29C71/02 ,  C09J7/02 ,  B28B11/08

CPC分类号： H01L51/003 ,  B32B7/06 ,  B32B7/12 ,  B32B2457/08 ,  B32B2457/20 ,  H01L27/1266 ,  H01L31/0392 ,  H01L31/03926 ,  H05K1/0393 ,  H05K3/007 ,  H05K2203/016 ,  Y02E10/50 ,  Y10T428/28

摘要： The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. The method for manufacturing the thin-film substrate includes: stacking the thin-film substrate, a tackiness/adhesive agent for temporary fixing and a hard substrate in this order; fixing the thin-film substrate on the hard substrate through the tackiness/adhesive agent; then forming the pattern; and subsequently peeling the thin-film substrate at an interface between the thin-film substrate and the tackiness/adhesive agent.

摘要翻译： 本发明提供一种用于在薄膜基板上有效且稳定地形成图案的制造方法。 薄膜基板的制造方法包括：依次堆叠薄膜基板，粘合剂/临时固定用粘合剂和硬质基板; 通过粘合/粘合剂将薄膜基材固定在硬质基材上; 然后形成图案; 并且随后在薄膜基材和粘性/粘合剂之间的界面剥离薄膜基材。

公开(公告)号：US20120222805A1

公开(公告)日：2012-09-06

申请号：US13411316

申请日：2012-03-02

申请人： Toshio SHINTANI ,  Yukio ARIMITSU

发明人： Toshio SHINTANI ,  Yukio ARIMITSU

IPC分类号： B32B3/24 ,  B32B3/10

CPC分类号： H01L21/6835 ,  C09J7/26 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2203/322 ,  H01M2/168 ,  Y10T428/24331

摘要： The present invention provides a manufacturing method for efficiently and stably forming a pattern on a thin-film substrate. A thin-film substrate, a tackiness adhesive sheet for thin-film substrate fixing, and a hard substrate are laminated in this order and a porous base material functioning as a core material of the tackiness adhesive sheet for thin-film substrate fixing has bore holes. Therefore, even if preliminary heating and drying is not applied, air bubbles are not generated between the thin-film substrate and the tackiness adhesive sheet for fixing during pattern formation on the thin-film substrate. This makes it possible to stably and efficiently form a pattern.

摘要翻译： 本发明提供一种用于在薄膜基板上有效且稳定地形成图案的制造方法。 薄膜基板，用于薄膜基板固定的粘合性粘合片和硬质基板依次层叠，作为用于薄膜基板固定的粘性粘合片的芯材的多孔基材具有钻孔 。 因此，即使不进行预热和干燥，在薄膜基板上形成图案时，在薄膜基板和用于固定的粘合性粘合片之间也不会产生气泡。 这使得可以稳定且有效地形成图案。