公开(公告)号：US06602733B2

公开(公告)日：2003-08-05

申请号：US09783021

申请日：2001-02-15

申请人： Shinji Iwahashi ,  Junichi Sekine ,  Hiroshi Yamasaki

发明人： Shinji Iwahashi ,  Junichi Sekine ,  Hiroshi Yamasaki

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages. The method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or others on a semiconductor chip so as to be connected with the circuit pattern of a semiconductor chip is mounted on a mounting board including electrodes formed on a board made of glass-epoxy based or other materials, comprises steps of, first, aligning the bumps with the electrodes and placing the semiconductor device on the mounting board, then while pressing from the upside of the semiconductor device to make the bumps and electrodes contact closely, applying ultrasonic vibration to the semiconductor device with the application direction Dv to be the direction of a diagonal of the semiconductor chip or a direction not parallel with any side of the approximate polygon formed by the arranged bumps, and fusing the bumps and electrodes by the generated heat.

摘要翻译： 一种用于制造能够确保接合强度和接合凸起而不发生凹坑或其他机械损伤的电路装置的方法。一种制造电路装置的方法，其中具有形成为大致多边形形状的多个凸起的半导体器件或其它 与半导体芯片的电路图案连接的半导体芯片安装在包括形成在由玻璃 - 环氧树脂或其它材料制成的电路板上的电极的安装板上，包括以下步骤：首先将凸块与 电极并将半导体器件放置在安装板上，然后在从半导体器件的上侧按压以使凸块和电极紧密接触的同时，施加超声波振动至半导体器件，其中施加方向Dv为对角线的方向 半导体芯片或与近似多边形形状的任何一侧不平行的方向 d，并且通过产生的热量将凸块和电极熔合。

公开(公告)号：US06811630B2

公开(公告)日：2004-11-02

申请号：US10181686

申请日：2002-07-19

申请人： Morio Tominaga ,  Shinji Iwahashi

发明人： Morio Tominaga ,  Shinji Iwahashi

IPC分类号： B29C6508

CPC分类号： H01L24/81 ,  B06B3/00 ,  G10K11/025 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75355 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： An ultrasonic vibration method and an ultrasonic vibration apparatus, which do not have a directional property in the direction of vibrations, are disclosed. A pair of ultrasonic horns (11), (12), each having an ultrasonic vibrator (13), (14) provided at an end portion thereof, are disposed in an intersecting relationship to each other, and the composite vibrations of transverse vibrations produced by the pair of ultrasonic horns (11), (12) when the other ultrasonic horns (12), (11) are excited to generate longitudinal vibrations are extracted at the intersecting point of the pair of horns (11), (12) and applied to a contact object member through a presser (22).

摘要翻译： 公开了一种在振动方向上不具有定向性的超声波振动法和超声波振动装置。 在其端部设置有超声波振子（13），（14）的一对超声波喇叭（11），（12）彼此以交叉关系设置，产生横向振动的复合振动 通过一对超声波喇叭（11），（12）在另一个超声波喇叭（12），（11）被激发以产生纵向振动时，在一对喇叭（11），（12）和 通过压脚（22）施加到接触物体构件。

公开(公告)号：US5582357A

公开(公告)日：1996-12-10

申请号：US333333

申请日：1994-11-02

申请人： Takao Kosaka ,  Akira Ono ,  Shinji Iwahashi

发明人： Takao Kosaka ,  Akira Ono ,  Shinji Iwahashi

IPC分类号： H01F41/06 ,  H01G13/02

CPC分类号： H01F41/092 ,  H01F41/068

摘要： The invention provides a coil winding apparatus which is simplified in structure, reduced in cost and improved in operation efficiency. The coil winding apparatus comprises a housing intermittently rotatable around a fixed axis between first and second positions, a plurality of spindles mounted for rotation on front and rear faces of the housing, a pair of drive sections including a bidirectional motor and provided independently of each other for transmitting rotation of the motor to rotate the spindles, an insulation sheet supply section opposed to the spindles on one of the faces of the housing when the housing is at any of the first and second positions for supplying films to bobbins mounted on the spindles, and a wire supply section for supplying wires to bobbins mounted on the other spindles. Since the drive sections are provided independently of each other for the different spindles, the directions and the speeds of rotation of the spindles can be set arbitrarily.

摘要翻译： 本发明提供一种结构简单，成本降低，操作效率提高的线圈卷绕装置。 线圈卷绕装置包括在第一和第二位置之间围绕固定轴线间歇地旋转的壳体，安装成用于在壳体的前表面和后表面上旋转的多个主轴，包括双向电动机并且彼此独立地设置的一对驱动部分 用于传递电动机的旋转以旋转主轴;当壳体处于用于向安装在主轴上的线轴供应薄膜的第一和第二位置中的任何一个位置时，在壳体的一个面上与主轴相对的绝缘片材供应部分， 以及用于将线材供给到安装在其他锭子上的线轴上的供线部分。 由于对于不同的主轴，驱动部分彼此独立地设置，因此可以任意地设定主轴的方向和旋转速度。