公开(公告)号：US20070019032A1

公开(公告)日：2007-01-25

申请号：US10575492

申请日：2004-10-25

申请人： Shinji Maekawa ,  Shunpei Yamazaki ,  Yuko Tachimura ,  Koji Muranaka

发明人： Shinji Maekawa ,  Shunpei Yamazaki ,  Yuko Tachimura ,  Koji Muranaka

IPC分类号： B41J2/135

CPC分类号： H01L29/4908 ,  B41J2/14129 ,  H01L27/1292 ,  H01L29/458 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78603

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. Therefore, the invention provides a method for narrowing (miniaturizing) the line width according to a method different from a conventional method. A region to be liquid-repellent is formed and further, a region to be lyophilic is formed selectively in the region to be liquid-repellent in a surface for forming a pattern, before forming a desired pattern. After that, a pattern for a wiring or the like is formed in the lyophilic region by a dropping method typified by an ink-jetting method for dropping a composition including a conductive material for the wiring or the like.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 因此，本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 形成防液体的区域，此外，在形成所需图案之前，在用于形成图案的表面中，在要斥液的区域中选择性地形成要进行亲液化的区域。 之后，通过滴落方式形成用于布线等的图案，该滴加方法是通过用于滴加包括用于布线的导电材料等的组合物的喷墨方法。

公开(公告)号：US07968461B2

公开(公告)日：2011-06-28

申请号：US10575492

申请日：2004-10-25

申请人： Shinji Maekawa ,  Shunpei Yamazaki ,  Yuko Tachimura ,  Koji Muranaka

发明人： Shinji Maekawa ,  Shunpei Yamazaki ,  Yuko Tachimura ,  Koji Muranaka

IPC分类号： H01L21/44

CPC分类号： H01L29/4908 ,  B41J2/14129 ,  H01L27/1292 ,  H01L29/458 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78603

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. Therefore, the invention provides a method for narrowing (miniaturizing) the line width according to a method different from a conventional method. A region to be liquid-repellent is formed and further, a region to be lyophilic is formed selectively in the region to be liquid-repellent in a surface for forming a pattern, before forming a desired pattern. After that, a pattern for a wiring or the like is formed in the lyophilic region by a dropping method typified by an ink-jetting method for dropping a composition including a conductive material for the wiring or the like.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 因此，本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 形成防液体的区域，此外，在形成所需图案之前，在用于形成图案的表面中，在要斥液的区域中选择性地形成要进行亲液化的区域。 之后，通过滴落方式形成用于布线等的图案，该滴加方法是通过用于滴加包括用于布线的导电材料等的组合物的喷墨方法。

公开(公告)号：US07859187B2

公开(公告)日：2010-12-28

申请号：US10576495

申请日：2004-11-05

申请人： Shunpei Yamazaki ,  Shinji Maekawa ,  Gen Fujii ,  Hideaki Kuwabara ,  Yuko Tachimura

发明人： Shunpei Yamazaki ,  Shinji Maekawa ,  Gen Fujii ,  Hideaki Kuwabara ,  Yuko Tachimura

IPC分类号： H01J1/62 ,  H01J9/24

CPC分类号： H01L27/12 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/66765 ,  H01L29/78696

摘要： It is an object of the invention to provide a display device which can be manufactured by a simplified manufacturing process by which the efficiency in the use of material is improved. It is a further object of the invention to provide a manufacturing method of the display device. It is another object of the invention to provide a fabrication technology for improving adhesion of a pattern. In view of the above problems, according to the present invention, a pattern is formed by a droplet discharge method. Particularly in the invention, base pretreatment is performed before/after a pattern is formed by a droplet discharge method. As a result of such base pretreatment, adhesion of a pattern can improved, and the pattern may be made finer.

摘要翻译： 本发明的目的是提供一种显示装置，其可以通过简化的制造工艺制造，通过该制造工艺提高了材料使用的效率。 本发明的另一个目的是提供一种显示装置的制造方法。 本发明的另一个目的是提供一种用于改进图案粘附的制造技术。 鉴于上述问题，根据本发明，通过液滴喷射法形成图案。 特别是在本发明中，在通过液滴喷射法形成图案之前/之后进行基础预处理。 作为这种基底预处理的结果，可以提高图案的粘附性，并且可以使图案更细。

公开(公告)号：US20070120471A1

公开(公告)日：2007-05-31

申请号：US10576495

申请日：2004-11-05

申请人： Shunpei Yamazaki ,  Shinji Maekawa ,  Gen Fujii ,  Hideaki Kuwabara ,  Yuko Tachimura

发明人： Shunpei Yamazaki ,  Shinji Maekawa ,  Gen Fujii ,  Hideaki Kuwabara ,  Yuko Tachimura

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01L27/12 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/66765 ,  H01L29/78696

摘要： It is an object of the invention to provide a display device which can be manufactured by a simplified manufacturing process by which the efficiency in the use of material is improved. It is a further object of the invention to provide a manufacturing method of the display device. It is another object of the invention to provide a fabrication technology for improving adhesion of a pattern. In view of the above problems, according to the present invention, a pattern is formed by a droplet discharge method. Particularly in the invention, base pretreatment is performed before/after a pattern is formed by a droplet discharge method. As a result of such base pretreatment, adhesion of a pattern can improved, and the pattern may be made finer.

摘要翻译： 本发明的目的是提供一种显示装置，其可以通过简化的制造工艺制造，通过该制造工艺提高了材料使用的效率。 本发明的另一个目的是提供一种显示装置的制造方法。 本发明的另一个目的是提供一种用于改进图案粘附的制造技术。 鉴于上述问题，根据本发明，通过液滴喷射法形成图案。 特别是在本发明中，在通过液滴喷射法形成图案之前/之后进行基础预处理。 作为这种基底预处理的结果，可以提高图案的粘附性，并且可以使图案更细。

公开(公告)号：US20050048289A1

公开(公告)日：2005-03-03

申请号：US10915428

申请日：2004-08-11

申请人： Koji Muranaka ,  Ryoji Nomura ,  Keitaro Imai ,  Shinji Maekawa

发明人： Koji Muranaka ,  Ryoji Nomura ,  Keitaro Imai ,  Shinji Maekawa

IPC分类号： B41J2/01 ,  G02B5/20 ,  B41J2/14

CPC分类号： B41J2/01 ,  B41J2202/09 ,  G02B5/201 ,  Y10S438/942 ,  Y10T428/31504

摘要： An object of the invention is to provide a resist composition which is possible to form a film by using a drawing means and which functions as a protective film used at the time of etching, adding impurities, or the like. In addition, an object is also to provide a manufacturing step of a semiconductor device in which a substance with high safety and that is easily treated can be used as a peeling solution, and which pays attention to an environment. A resist composition of the invention contains water-soluble homopolymer, water, or a solvent that has compatibility with water and can dissolve the water-soluble homopolymer. In addition, a method for manufacturing the semiconductor device of the invention has a step of removing the protective film formed by discharging the resist composition of the invention by using a drawing means with water after using it.

摘要翻译： 本发明的目的是提供一种抗蚀剂组合物，其可以通过使用拉伸装置形成膜，并且其作为在蚀刻时使用的保护膜，添加杂质等。 此外，目的还在于提供一种半导体装置的制造工序，其中可以使用具有高安全性且易于处理的物质作为剥离溶液，并注意环境。 本发明的抗蚀剂组合物含有水溶性均聚物，水或与水相容并能溶解水溶性均聚物的溶剂。 此外，本发明的半导体装置的制造方法具有通过在使用了本发明的抗蚀剂组合物后通过使用拉伸装置除去形成的保护膜的步骤。

公开(公告)号：US08278204B2

公开(公告)日：2012-10-02

申请号：US13012055

申请日：2011-01-24

申请人： Shinji Maekawa ,  Koji Muranaka

发明人： Shinji Maekawa ,  Koji Muranaka

IPC分类号： H01L21/44

CPC分类号： H01L29/66765 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/66757

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. The invention provides a method for narrowing (miniaturizing) a line width according to a method different from a conventional method. One feature of the invention is that a plasma treatment is performed before forming a wiring or the like by a dropping method typified by an ink-jetting method. As the result of the plasma treatment, a surface for forming a conductive film is modified to be liquid-repellent. Consequently, a wiring or the like formed by a dropping method can be miniaturized.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 本发明的一个特征是在通过喷墨方法代表的滴下方法形成布线等之前进行等离子体处理。 作为等离子体处理的结果，用于形成导电膜的表面被改性为疏液性。 因此，通过滴下法形成的布线等可以小型化。

公开(公告)号：US20110177689A1

公开(公告)日：2011-07-21

申请号：US13012055

申请日：2011-01-24

申请人： Shinji Maekawa ,  Koji Muranaka

发明人： Shinji Maekawa ,  Koji Muranaka

IPC分类号： H01L21/283

CPC分类号： H01L29/66765 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/66757

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. The invention provides a method for narrowing (miniaturizing) a line width according to a method different from a conventional method. One feature of the invention is that a plasma treatment is performed before forming a wiring or the like by a dropping method typified by an ink-jetting method. As the result of the plasma treatment, a surface for forming a conductive film is modified to be liquid-repellent. Consequently, a wiring or the like formed by a dropping method can be miniaturized.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 本发明的一个特征是在通过喷墨法代表的滴下方法形成布线等之前进行等离子体处理。 作为等离子体处理的结果，用于形成导电膜的表面被改性为疏液性。 因此，通过滴下法形成的布线等可以小型化。

公开(公告)号：US20070164280A1

公开(公告)日：2007-07-19

申请号：US10569595

申请日：2004-08-25

申请人： Shinji Maekawa ,  Osamu Nakamura ,  Koji Muranaka

发明人： Shinji Maekawa ,  Osamu Nakamura ,  Koji Muranaka

IPC分类号： H01L29/04

CPC分类号： H01L29/66757 ,  H01L27/12 ,  H01L27/1292 ,  H01L29/66765

摘要： The present invention provides a thin film transistor that can be manufactured at lower cost and at higher yield by simplifying a manufacturing process, a manufacturing method thereof, and a manufacturing method of a display device using the thin film transistor. According to this invention, a pattern used in a pattering process is formed by using a droplet discharging method. The pattern is formed by selectively discharging a composition comprising an organic resin. By using the pattern, an electrically conductive material, an insulator or semiconductor constituting a semiconductor element, are patterned into a desired shape by a simple process.

摘要翻译： 本发明提供一种薄膜晶体管，其可以通过简化制造工艺，其制造方法和使用薄膜晶体管的显示装置的制造方法以较低的成本和更高的产率制造。 根据本发明，通过使用液滴喷射法形成用于图案化处理的图案。 通过选择性地排出包含有机树脂的组合物形成图案。 通过使用该图案，构成半导体元件的导电材料，绝缘体或半导体通过简单的工艺被图案化成所需的形状。

公开(公告)号：US07226819B2

公开(公告)日：2007-06-05

申请号：US10970299

申请日：2004-10-21

申请人： Shinji Maekawa ,  Koji Muranaka

发明人： Shinji Maekawa ,  Koji Muranaka

IPC分类号： H01L21/84 ,  H01L21/00

CPC分类号： H01L29/66765 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/66757

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. The invention provides a method for narrowing (miniaturizing) a line width according to a method different from a conventional method. One feature of the invention is that a plasma treatment is performed before forming a wiring or the like by a dropping method typified by an ink-jetting method. As the result of the plasma treatment, a surface for forming a conductive film is modified to be liquid-repellent. Consequently, a wiring or the like formed by a dropping method can be miniaturized.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 本发明的一个特征是在通过喷墨法代表的滴下方法形成布线等之前进行等离子体处理。 作为等离子体处理的结果，用于形成导电膜的表面被改性为疏液性。 因此，通过滴下法形成的布线等可以小型化。

公开(公告)号：US07875542B2

公开(公告)日：2011-01-25

申请号：US11749804

申请日：2007-05-17

申请人： Shinji Maekawa ,  Koji Muranaka

发明人： Shinji Maekawa ,  Koji Muranaka

IPC分类号： H01L21/44

CPC分类号： H01L29/66765 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/66757

摘要： It is required that a line width of a wiring is prevented from being wider to be miniaturized when the wiring or the like is formed by a dropping method typified by an ink-jetting method. The invention provides a method for narrowing (miniaturizing) a line width according to a method different from a conventional method. One feature of the invention is that a plasma treatment is performed before forming a wiring or the like by a dropping method typified by an ink-jetting method. As the result of the plasma treatment, a surface for forming a conductive film is modified to be liquid-repellent. Consequently, a wiring or the like formed by a dropping method can be miniaturized.

摘要翻译： 当通过喷墨法代表的滴落方法形成布线等时，要求布线的线宽被更宽地小型化。 本发明提供了一种根据与传统方法不同的方法来缩小（小型化）线宽的方法。 本发明的一个特征是在通过喷墨方法代表的滴下方法形成布线等之前进行等离子体处理。 作为等离子体处理的结果，用于形成导电膜的表面被改性为疏液性。 因此，通过滴下法形成的布线等可以小型化。