公开(公告)号：US07554242B2

公开(公告)日：2009-06-30

申请号：US11332864

申请日：2006-01-16

申请人： Shinya Aoki ,  Kazuhiko Akahane ,  Yoshio Maeda

发明人： Shinya Aoki ,  Kazuhiko Akahane ,  Yoshio Maeda

IPC分类号： H03H9/145 ,  H01L23/00 ,  H01L41/08

CPC分类号： H03H9/059 ,  H03H3/08 ,  H03H9/1092

摘要： A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.

摘要翻译： 表面声波芯片，其整体地在压电基片上形成有数字式换能器。 在表面声波芯片中，数字式换能器延伸到压电基板的边缘，并且分隔部一直设置到压电基板的边缘，以分隔电极图案， 数字传感器。

公开(公告)号：US20060158062A1

公开(公告)日：2006-07-20

申请号：US11332864

申请日：2006-01-16

申请人： Shinya Aoki ,  Kazuhiko Akahane ,  Yoshio Maeda

发明人： Shinya Aoki ,  Kazuhiko Akahane ,  Yoshio Maeda

IPC分类号： H03H9/145

CPC分类号： H03H9/059 ,  H03H3/08 ,  H03H9/1092

摘要： A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.