公开(公告)号：US20130297981A1

公开(公告)日：2013-11-07

申请号：US13537528

申请日：2012-06-29

申请人： Shiqun Gu ,  Michael Laisne ,  Matthew M. Nowak ,  Glen T. Kim ,  Mark C. Chan ,  Hongjun Yao

发明人： Shiqun Gu ,  Michael Laisne ,  Matthew M. Nowak ,  Glen T. Kim ,  Mark C. Chan ,  Hongjun Yao

IPC分类号： G01R31/3177

CPC分类号： G01R31/3177 ,  H01L22/34 ,  H01L23/3128 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15311

摘要： A first apparatus, such as a die or a semiconductor package, has signal paths extending through the apparatus. The signal paths can include through vias and other components. The signal paths are operable to communicate with a second apparatus when the second apparatus is stacked with the first apparatus. The first apparatus also has pass gates. Each pass gate is configurable in response to a signal, to short a pair of the signal paths to enable substantially simultaneous testing of the signal paths. The pass gates may be configurable to isolate the signal paths during operation of the first apparatus.

摘要翻译： 诸如裸片或半导体封装的第一装置具有延伸穿过该装置的信号路径。 信号路径可以包括通孔和其它组件。 当第二装置与第一装置堆叠时，信号路径可操作以与第二装置通信。 第一个装置也有通过门。 每个通过门可以响应于信号而配置，以缩短一对信号路径以实现信号路径的基本上同时的测试。 通过门可以被配置为在第一设备的操作期间隔离信号路径。