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    METHOD OF MANUFACTURING ORGANIC EL DEVICE
    1.
    发明申请
    METHOD OF MANUFACTURING ORGANIC EL DEVICE 审中-公开
    制造有机EL器件的方法

    公开(公告)号：US20120045856A1

    公开(公告)日：2012-02-23

    申请号：US13149821

    申请日：2011-05-31

    申请人： Shiro SUMITA ,  Atsushi Hosoda ,  Tetsuo Ishida ,  Masuyuki Oota

    发明人： Shiro SUMITA ,  Atsushi Hosoda ,  Tetsuo Ishida ,  Masuyuki Oota

    IPC分类号： H01L33/48

    CPC分类号： H05B33/10 ,  H05B33/04

    摘要： According to one embodiment, a method of manufacturing an organic EL device is disclosed. The method can arrange an adhesive agent of an ultraviolet curable type between a first substrate on which a plurality of light emitting parts are formed in a predetermined direction and a second substrate arranged to face the first substrate separately so as to surround the light emitting parts. Each of the light emitting parts comprises a plurality of organic EL elements. The method can form a substrate pair by exposing the adhesive agent to ultraviolet rays to bond the first substrate and the second substrate to each other with the adhesive agent. The method can place the substrate pair on a first holding member capable of holding an entire surface of the first substrate or the second substrate. The method can place the substrate pair on a second holding member after a predetermined period of time has passed, the second holding member being capable of holding the substrate pair with at least two supporting members positioned along the first substrate or the second substrate. The method can cut the substrate pair around the adhesive agent with each of the light emitting parts as a unit.

    摘要翻译： 根据一个实施例，公开了一种制造有机EL器件的方法。 该方法可以在其上沿预定方向形成有多个发光部分的第一基板和布置成分别布置成围绕发光部分的第二基板之间布置可紫外固化型粘合剂。 每个发光部分包括多个有机EL元件。 该方法可以通过将粘合剂暴露于紫外线来形成基板对，以用粘合剂将第一基板和第二基板彼此粘合。 该方法可以将衬底对放置在能够保持第一衬底或第二衬底的整个表面的第一保持构件上。 该方法可以在经过预定时间后将基板对放置在第二保持构件上，第二保持构件能够将基板对保持在沿着第一基板或第二基板定位的至少两个支撑构件。 该方法可以将每个发光部件作为一个单元切割粘合剂周围的基板对。

    Thermoplastic resin composition
    3.
    发明授权
    Thermoplastic resin composition 失效
    热塑性树脂组合物

    公开(公告)号：US4656212A

    公开(公告)日：1987-04-07

    申请号：US819034

    申请日：1986-01-15

    申请人： Atsushi Hosoda ,  Tadao Satoh ,  Takehisa Mizuno

    发明人： Atsushi Hosoda ,  Tadao Satoh ,  Takehisa Mizuno

    IPC分类号： C08L51/00 ,  C08K5/49 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L25/00 ,  C08L25/08 ,  C08L25/12 ,  C08L33/00 ,  C08L33/02 ,  C08L51/02 ,  C08L51/04 ,  C08L51/06 ,  C08L73/00 ,  C08L101/00 ,  C08K5/24

    CPC分类号： C08L25/08 ,  C08L51/04

    摘要： A thermoplastic resin composition having excellent impact strength and high heat distortion temperatures consisting essentially of (A) 10 to 90 parts by weight of a styrene-methacrylic acid type copolymer resin selected from a styrene/methacrylic acid copolymer resin obtained by polymerizing 97 to 65% by weight of styrene and 3 to 35% by weight of methacrylic acid and a styrene/methyl methacrylate/methacrylic acid copolymer resin obtained by polymerizing 48.6 to 64.9% by weight of styrene, 48.4 to 0.1% by weight of methyl methacrylate and 3 to 35% by weight of methacrylic acid, (B) 90 to 10 parts by weight of a graft copolymer resin obtained by polymerizing 70 to 20% by weight of methyl methacrylate or a monomeric mixture composed of from less than 100 to 20% by weight of methyl methacrylate and from more than 0 to 80% by weight of styrene in the presence of 30 to 80% by weight of a rubbery polymer, and (C) 0.001 to 0.2% by weight as silicon, based on the total weight of (A) and (B), of an organopolysiloxane.

    摘要翻译： 一种具有优异的冲击强度和高热变形温度的热塑性树脂组合物，其基本上由（A）10至90重量份的苯乙烯 - 甲基丙烯酸类共聚物树脂组成，所述苯乙烯 - 甲基丙烯酸类共聚物树脂选自通过聚合97-65％ 的苯乙烯和3〜35重量％的甲基丙烯酸和通过聚合48.6〜64.9重量％的苯乙烯，48.4〜0.1重量％的甲基丙烯酸甲酯和3〜35重量份得到的苯乙烯/甲基丙烯酸甲酯/甲基丙烯酸共聚物树脂 （B）90〜10重量份通过聚合70〜20重量％的甲基丙烯酸甲酯或由少于100〜20重量％的甲基丙烯酸甲酯组成的接枝共聚物树脂， 在30〜80重量％的橡胶状聚合物的存在下，含有0〜80重量％的苯乙烯，（C）0.001〜0.2重量％的硅，以（A） 和（B），o f有机聚硅氧烷。

    Surface treatment agent for copper and copper alloy
    4.
    发明申请
    Surface treatment agent for copper and copper alloy 有权
    铜和铜合金表面处理剂

    公开(公告)号：US20050061202A1

    公开(公告)日：2005-03-24

    申请号：US10481018

    申请日：2002-06-18

    申请人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

    发明人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

    IPC分类号： C23C22/52 ,  C23F1/18 ,  H05K3/26 ,  H05K3/38 ,  C09D11/00

    CPC分类号： C23F1/18 ,  C23C22/52 ,  H05K3/383 ,  H05K2203/124

    摘要： The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

    摘要翻译： 铜和铜合金表面处理剂含有过氧化氢，无机酸，唑类化合物，银离子和卤离子。 铜和铜合金表面处理剂可用于电子工业印刷线路板的生产。 表面处理剂使铜和铜合金的表面变粗糙。 特别地，表面处理剂可以在具有电镀镜面的铜包覆基板上形成均匀且无起伏的粗糙表面，这在常规技术中是困难的，从而显着提高与抗蚀剂，阻焊剂的粘附性，另外， 预浸料和用于安装电子部件的树脂。

    Surface treatment agent for copper and copper alloy
    6.
    发明授权
    Surface treatment agent for copper and copper alloy 有权
    铜和铜合金表面处理剂

    公开(公告)号：US07232528B2

    公开(公告)日：2007-06-19

    申请号：US10481018

    申请日：2002-06-18

    申请人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

    发明人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

    IPC分类号： H01L21/302

    CPC分类号： C23F1/18 ,  C23C22/52 ,  H05K3/383 ,  H05K2203/124

    摘要： The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

    摘要翻译： 铜和铜合金表面处理剂含有过氧化氢，无机酸，唑类化合物，银离子和卤离子。 铜和铜合金表面处理剂可用于电子工业印刷线路板的生产。 表面处理剂使铜和铜合金的表面变粗糙。 特别地，表面处理剂可以在具有电镀镜面的铜包覆基板上形成均匀且无起伏的粗糙表面，这在常规技术中是困难的，从而显着提高与抗蚀剂，阻焊剂的粘附性，另外， 预浸料和用于安装电子部件的树脂。