摘要:
A lower supporting pin module 22 is given a shape having a contact surface 26a. On the occasion of position recognition for determining a position of a pin on the lower supporting pin module 22, an image of the lower supporting pin module 22 is captured, and the image is subjected to recognition processing, to thus detect an outer shape of an upper shaft 24B. Even when an extraneous matter on a downside surface of a substrate adheres to the contact surface 26a, the position of the lower supporting pin module 22 can be stably recognized with superior recognition precision.
摘要:
A lower supporting pin module 22 is given a shape having a contact surface 26a. On the occasion of position recognition for determining a position of a pin on the lower supporting pin module 22, an image of the lower supporting pin module 22 is captured, and the image is subjected to recognition processing, to thus detect an outer shape of an upper shaft 24B. Even when an extraneous matter on a downside surface of a substrate adheres to the contact surface 26a, the position of the lower supporting pin module 22 can be stably recognized with superior recognition precision.
摘要:
An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.
摘要:
An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.
摘要:
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support the substrate includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the substrate to support the substrate. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
摘要:
A pre-array temporary placement area A2 and a post-return temporary placement area A3 are set along with a lower receiving area A1. Temporary placement positions TP for lower receiving pins 22 in the pre-array temporary placement area A2 and the post-return temporary placement area A3 are previously assigned in consideration of requirements for preventing occurrence of interference between the lower receiving pins 22, which would otherwise occur during transfer of the lower receiving pins 22, and in accordance with array positions AP of the lower receiving pins 22 in the lower receiving area A1. Further, a transfer sequence is set in accordance with array positions AP.
摘要:
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support a board includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the board to support the board. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
摘要:
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support a board includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the board to support the board. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
摘要:
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support the substrate includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the substrate to support the substrate. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.
摘要:
A pre-array temporary placement area A2 and a post-return temporary placement area A3 are set along with a lower receiving area A1. Temporary placement positions TP for lower receiving pins 22 in the pre-array temporary placement area A2 and the post-return temporary placement area A3 are previously assigned in consideration of requirements for preventing occurrence of interference between the lower receiving pins 22, which would otherwise occur during transfer of the lower receiving pins 22, and in accordance with array positions AP of the lower receiving pins 22 in the lower receiving area A1. Further, a transfer sequence is set in accordance with array positions AP.