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公开(公告)号:US06803655B2
公开(公告)日:2004-10-12
申请号:US09682131
申请日:2001-07-25
申请人: Shohhei Fujio , Hideki Kabayama
发明人: Shohhei Fujio , Hideki Kabayama
IPC分类号: H01L2334
CPC分类号: H01L23/50 , H01L24/48 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01039 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , Y10S257/924 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is connected to power wiring and the ground plane to prevent EMI caused by switching noise current generated by the power circuit of the die.
摘要翻译: 电源引线和接地引线通过内部封装布线基板连接到管芯的相应焊盘。 在沿着模具的底面延伸的内部封装布线基板的模具内形成接地面,并与接地引线连接。 去耦电容器连接到电源线和接地平面,以防止由模具的电源电路产生的开关噪声电流引起的EMI。