Substrate detection device and substrate conveyance apparatus
    1.
    发明授权
    Substrate detection device and substrate conveyance apparatus 有权
    基板检测装置和基板输送装置

    公开(公告)号:US08125651B2

    公开(公告)日:2012-02-28

    申请号:US12864785

    申请日:2009-01-14

    IPC分类号: G01B11/14

    摘要: An object is to provide a substrate conveyance apparatus and a substrate detection device capable of improving flexibility in arrangement layout.The substrate detection device includes a projector 41 for projecting inspection light 40 so as to pass through a predetermined position on a path of a substrate 4 conveyed by conveyance belts 26, a light receiver 42 for receiving the inspection light 40 projected by the projector 41, and a detector (a control device 15) for detecting that the substrate 4 reaches the predetermined position based on a decrease in the amount of received light of the inspection light 40 received by the light receiver 42 when the substrate 4 conveyed by the conveyance belts 26 reaches the predetermined position and a portion of the inspection light 40 is blocked by the substrate 4. The inspection light 40 is projected from the projector 41 so as to include opposite ends of a width direction of the conveyance belts 26 in an optical path of the inspection light in a direction orthogonal to a conveyance direction of the substrate 4 conveyed by the conveyance belts 26 and the light receiver 42 receives the inspection light passing through upper and lower regions of the conveyance belts 26 in the width direction.

    摘要翻译: 本发明的目的是提供一种能够提高布置布局的灵活性的基板输送装置和基板检测装置。 基板检测装置包括:投影仪41,其用于突出检测光40,以通过由传送带26传送的基板4的路径上的预定位置,用于接收由投影仪41投射的检查光40的光接收器42; 以及检测器(控制装置15),用于基于当由传送带26传送的基板4时基板4接收到的检查光40的接收光量的下降而检测到基板4到达预定位置 到达预定位置,并且检查光40的一部分被基板4阻挡。检查光40从投影仪41突出,以包括传送带26的宽度方向的相对端在光路 在与由传送带26和光接收器42传送的基板4的传送方向正交的方向上的检查光接收插入件 分光穿过传送带26的宽度方向的上下区域。

    SUBSTRATE DETECTION DEVICE AND SUBSTRATE CONVEYANCE APPARATUS
    2.
    发明申请
    SUBSTRATE DETECTION DEVICE AND SUBSTRATE CONVEYANCE APPARATUS 有权
    基板检测装置和基板输送装置

    公开(公告)号:US20100309484A1

    公开(公告)日:2010-12-09

    申请号:US12864785

    申请日:2009-01-14

    IPC分类号: G01B11/14

    摘要: An object is to provide a substrate conveyance apparatus and a substrate detection device capable of improving flexibility in arrangement layout.The substrate detection device includes a projector 41 for projecting inspection light 40 so as to pass through a predetermined position on a path of a substrate 4 conveyed by conveyance belts 26, a light receiver 42 for receiving the inspection light 40 projected by the projector 41, and a detector (a control device 15) for detecting that the substrate 4 reaches the predetermined position based on a decrease in the amount of received light of the inspection light 40 received by the light receiver 42 when the substrate 4 conveyed by the conveyance belts 26 reaches the predetermined position and a portion of the inspection light 40 is blocked by the substrate 4. The inspection light 40 is projected from the projector 41 so as to include opposite ends of a width direction of the conveyance belts 26 in an optical path of the inspection light in a direction orthogonal to a conveyance direction of the substrate 4 conveyed by the conveyance belts 26 and the light receiver 42 receives the inspection light passing through upper and lower regions of the conveyance belts 26 in the width direction.

    摘要翻译: 本发明的目的是提供一种能够提高布置布局的灵活性的基板输送装置和基板检测装置。 基板检测装置包括:投影仪41,其用于突出检测光40,以通过由传送带26传送的基板4的路径上的预定位置,用于接收由投影仪41投射的检查光40的光接收器42; 以及检测器(控制装置15),用于基于当由传送带26传送的基板4时基板4接收到的检查光40的接收光量的下降而检测到基板4到达预定位置 到达预定位置,并且检查光40的一部分被基板4阻挡。检查光40从投影仪41突出,以包括传送带26的宽度方向的相对端在光路 在与由传送带26和光接收器42传送的基板4的传送方向正交的方向上的检查光接收插入件 分光穿过传送带26的宽度方向的上下区域。

    ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
    3.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
    电子元件安装设备和电子元件安装方法

    公开(公告)号:US20090049681A1

    公开(公告)日:2009-02-26

    申请号:US12194262

    申请日:2008-08-19

    IPC分类号: B23P19/00

    摘要: The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.

    摘要翻译: 用于将电子部件安装在基板上的本发明的电子部件安装装置包括:基板定位单元,用于将单个大尺寸基板或两个小尺寸基板承载在各个安装作业位置中的安装输送机中,以及基板下侧支撑部 布置在安装输送机下方并且包括第一下侧支撑部分和第二下侧支撑部分。 因此,在处理大尺寸基板的情况下,可以将单个基板定位在安装工作位置,并且在处理小尺寸基板的情况下将多个基板单独定位在多个安装工作​​位置。 这通过紧凑的设备确保了对多种类型的基板的灵活部件安装工作。

    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    4.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件安装系统和电子元件安装方法

    公开(公告)号:US20090049682A1

    公开(公告)日:2009-02-26

    申请号:US12194310

    申请日:2008-08-19

    IPC分类号: B23P19/00 H05K3/30

    摘要: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.

    摘要翻译: 在包括串联耦合的多个电子部件安装装置的电子部件安装系统中,将电子部件安装在基板上以制造安装的基板的系统,将承载在安装输送机中的基板暂时置于基板的待机状态 备用区域由位于一个电子部件安装装置上游的另一个电子部件安装装置的一个电子部件安装装置的第一传送输送机(输入输送机)和第二输送机(搬出输送机)形成。 这消除了由于基板转移引起的时间浪费,并且通过紧凑的设备提高了生产效率。

    Electronic component mounting method providing a substrate standby area
    5.
    发明授权
    Electronic component mounting method providing a substrate standby area 有权
    提供基板待机区域的电子元件安装方法

    公开(公告)号:US08789265B2

    公开(公告)日:2014-07-29

    申请号:US12194310

    申请日:2008-08-19

    IPC分类号: B23P19/00

    摘要: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.

    摘要翻译: 在包括串联耦合的多个电子部件安装装置的电子部件安装系统中,将电子部件安装在基板上以制造安装的基板的系统,将承载在安装输送机中的基板暂时置于基板的待机状态 备用区域由位于一个电子部件安装装置上游的另一个电子部件安装装置的一个电子部件安装装置的第一传送输送机(输入输送机)和第二输送机(搬出输送机)形成。

    COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS
    6.
    发明申请
    COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS 有权
    组件安装设备中的组件安装和底板输送方法

    公开(公告)号:US20120285012A1

    公开(公告)日:2012-11-15

    申请号:US13511789

    申请日:2010-11-29

    IPC分类号: H05K3/30

    摘要: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

    摘要翻译: 本发明的目的是提供一种组件安装装置,其包括多个基板输送通道,并有效地控制基板的承载顺序,从而能够提高生产率,并且还提供一种基板输送方法 安装装置。 一种构造,其特征在于,包括:平行布置的包括输送机(10A,10B,10C,10D)的输送线横向的部件供给单元(20A,20B) 以及基板分配单元(M3B),其被配置为在从所述元件供给单元(d)的输送器(10B,10C)输出基板请求信号(R)的情况下,分配从上游装置输送的基板(13) 如图20A,20B所示,当在新的基板(13)的转印工作开始之前,对于靠近元件供给单元(20b)的输送机(10D)输出基板请求信号R时,新的基板 )被输送到输送机(10D)中。 因此,可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

    Component mounting apparatus and substrate conveyance method in component mounting apparatus
    7.
    发明授权
    Component mounting apparatus and substrate conveyance method in component mounting apparatus 有权
    零件安装装置和元件安装装置中的基板输送方法

    公开(公告)号:US08510937B2

    公开(公告)日:2013-08-20

    申请号:US13511789

    申请日:2010-11-29

    IPC分类号: H05K13/04

    摘要: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

    摘要翻译: 本发明的目的是提供一种组件安装装置,其包括多个基板输送通道,并有效地控制基板的承载顺序,从而能够提高生产率,并且还提供一种基板输送方法 安装装置。 一种构造,其特征在于,包括:平行布置的包括输送机(10A,10B,10C,10D)的输送线横向的部件供给单元(20A,20B) 以及基板分配单元(M3B),其被配置为在从所述元件供给单元(d)的输送器(10B,10C)输出基板请求信号(R)的情况下,分配从上游装置输送的基板(13) 如图20A,20B所示,当在新的基板(13)的转印工作开始之前,对于靠近元件供给单元(20b)的输送机(10D)输出基板请求信号R时,新的基板 )被输送到输送机(10D)中。 因此,可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

    COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS
    8.
    发明申请
    COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COMPONENT MOUNTING APPARATUS 有权
    组件安装设备中的组件安装和底板输送方法

    公开(公告)号:US20120272511A1

    公开(公告)日:2012-11-01

    申请号:US13511774

    申请日:2010-11-29

    IPC分类号: H05K13/02

    摘要: An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D). Therefore, substrates can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.

    摘要翻译: 本发明的目的是提供一种组件安装装置,其包括多个基板输送通道,并有效地控制基板的承载顺序,从而能够提高生产率,并且还提供一种基板输送方法 安装装置。 一种构造,其特征在于,包括:平行布置的包括输送机(10A,10B,10C,10D)的输送线横向的部件供给单元(20A,20B) 以及在从多个输送机输出基板请求信号(R)的情况下,配置成分配从上游装置输送的基板)的基板分配单元(M3B),新的基板(13)从 所述基板分配单元(M3B)输送到输送机(10A,10B,10C,10D)中最靠近所述部件供应单元(20A,20B)的输送器(10A,10D)中。 因此,可以将基板优先地携带到在组件安装效率方面更有利的输送机中。

    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    10.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件安装系统和电子元件安装方法

    公开(公告)号:US20130047427A1

    公开(公告)日:2013-02-28

    申请号:US13578364

    申请日:2012-03-02

    IPC分类号: H05K13/04 H05K3/30

    摘要: In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.

    摘要翻译: 在通过将每个具有第一基板输送机构12A和第二基板输送机构12B的电子部件安装装置M1〜M4A连接在一起的电子部件安装系统1中,电子部件安装装置M4A包括:第一托盘进给器20A,其存储电子 由作为第一工作操作机构的部件安装机构的第一安装头15A提取的部件和存储由部件安装机构的第二安装头15B抽出的电子部件作为第二工作操作机构的第二托盘进给器20B。