摘要:
An object is to provide a substrate conveyance apparatus and a substrate detection device capable of improving flexibility in arrangement layout.The substrate detection device includes a projector 41 for projecting inspection light 40 so as to pass through a predetermined position on a path of a substrate 4 conveyed by conveyance belts 26, a light receiver 42 for receiving the inspection light 40 projected by the projector 41, and a detector (a control device 15) for detecting that the substrate 4 reaches the predetermined position based on a decrease in the amount of received light of the inspection light 40 received by the light receiver 42 when the substrate 4 conveyed by the conveyance belts 26 reaches the predetermined position and a portion of the inspection light 40 is blocked by the substrate 4. The inspection light 40 is projected from the projector 41 so as to include opposite ends of a width direction of the conveyance belts 26 in an optical path of the inspection light in a direction orthogonal to a conveyance direction of the substrate 4 conveyed by the conveyance belts 26 and the light receiver 42 receives the inspection light passing through upper and lower regions of the conveyance belts 26 in the width direction.
摘要:
An object is to provide a substrate conveyance apparatus and a substrate detection device capable of improving flexibility in arrangement layout.The substrate detection device includes a projector 41 for projecting inspection light 40 so as to pass through a predetermined position on a path of a substrate 4 conveyed by conveyance belts 26, a light receiver 42 for receiving the inspection light 40 projected by the projector 41, and a detector (a control device 15) for detecting that the substrate 4 reaches the predetermined position based on a decrease in the amount of received light of the inspection light 40 received by the light receiver 42 when the substrate 4 conveyed by the conveyance belts 26 reaches the predetermined position and a portion of the inspection light 40 is blocked by the substrate 4. The inspection light 40 is projected from the projector 41 so as to include opposite ends of a width direction of the conveyance belts 26 in an optical path of the inspection light in a direction orthogonal to a conveyance direction of the substrate 4 conveyed by the conveyance belts 26 and the light receiver 42 receives the inspection light passing through upper and lower regions of the conveyance belts 26 in the width direction.
摘要:
The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.
摘要:
In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.
摘要:
In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.
摘要:
An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要:
An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output from conveyors (10B, 10C) which are farther from the component supplying units (20A, 20B), when the substrate request signal R is output for a conveyor (10D) which is closer to the component supplying unit (20b) prior to start of a transferring work of the new substrate (13), the new substrate (13) is carried into the conveyor (10D). Therefore, a substrate can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要:
An object of the invention is to provide a component mounting apparatus which includes a plurality of substrate conveying lanes and which efficiently controls the order of carrying in of substrates, thereby capable of improving productivity, and also is to provide a substrate conveyance method in the component mounting apparatus. In a configuration which includes: component supplying units (20A, 20B) positioned lateral to conveyor lines including conveyors (10A, 10B, 10C, 10D) arranged in parallel; and a substrate distributing unit (M3B) configured to distribute substrates (13) delivered from an upstream apparatus, in the case where a substrate request signal (R) is output for a plurality of conveyors, a new substrate (13) is carried in from the substrate distributing unit (M3B) into conveyors (10A, 10D) which are closest to the component supplying units (20A, 20B) among the conveyors (10A, 10B, 10C, 10D). Therefore, substrates can be preferentially carried into conveyors which are more advantageous in component mounting efficiency.
摘要:
In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
摘要:
In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.