公开(公告)号：US20250063708A1

公开(公告)日：2025-02-20

申请号：US18722375

申请日：2022-11-16

Applicant: Siemens Aktiengesellschaft

Inventor： Bernd Müller ,  Ulrich Wittreich ,  Kay Jarchoff ,  Michael Hanisch ,  Michael Erdmann ,  Carsten Borwieck

IPC: H05K13/08 ,  H05K13/04

Abstract: Various embodiments of the teachings herein include a method for operating an electronics production line for producing electronic assemblies. The electronics production line comprises a device to apply joining material onto component carriers, an assembly device to place electronic components onto the component carriers, a joining device to join the electronic components to the component carriers, and a transport to transport the component carriers through the production line. An example method includes: transporting a process parameter acquisition system through the electronics production line on the transport; measuring actual process parameter values with the process parameter acquisition system; providing setpoint process parameter values; determining any deviations between actual and setpoint process parameter values; and providing a dataset including the deviations.