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公开(公告)号：US20220400590A1
公开(公告)日：2022-12-15
申请号：US17639006
申请日：2020-06-26
Applicant: Siemens Aktiengesellschaft
Inventor： Michael Hanisch , Jonas Massierer , Marco Matiwe , Dennis Sommerfeld , Ulrich Wittreich , Kay Jarchoff , Jörg Schubert , Dirk Wormuth
Abstract: Various embodiments of the teachings herein include a device for detecting process parameters during a pass through an assembly line for assembling electronic components and/or for applying joining materials. The device may include: a carrier for transport by a conveying system of the assembly line and configured to receive a test plate; a sensor for measuring a process parameter during the pass; and a force sensor arranged to detect a force acting on the test plate during the pass.
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公开(公告)号：US20220333961A1
公开(公告)日：2022-10-20
申请号：US17638847
申请日：2020-06-26
Applicant: Siemens Aktiengesellschaft
Inventor： Michael Hanisch , Nora Jeske , Jonas Massierer , Marco Matiwe , Dennis Sommerfeld , Ulrich Wittreich
IPC: G01D21/02
Abstract: Various embodiments of the teachings herein include a sensor element for recording process parameters at a measurement point in a sintering press/sintering plant. The sensor element comprises: a first temperature sensor; and a force sensor. A force and a temperature are recorded at the measurement point at which the sensor element is arranged.
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Patent Agency Ranking
公开(公告)号：US11828622B2
公开(公告)日：2023-11-28
申请号：US17638847
申请日：2020-06-26
Applicant: Siemens Aktiengesellschaft
Inventor： Michael Hanisch , Nora Jeske , Jonas Massierer , Marco Matiwe , Dennis Sommerfeld , Ulrich Wittreich
IPC: G01D21/02
CPC classification number: G01D21/02
Abstract: Various embodiments of the teachings herein include a sensor element for recording process parameters at a measurement point in a sintering press/sintering plant. The sensor element comprises: a first temperature sensor; and a force sensor. A force and a temperature are recorded at the measurement point at which the sensor element is arranged.
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公开(公告)号：US20250063708A1
公开(公告)日：2025-02-20
申请号：US18722375
申请日：2022-11-16
Applicant: Siemens Aktiengesellschaft
Inventor： Bernd Müller , Ulrich Wittreich , Kay Jarchoff , Michael Hanisch , Michael Erdmann , Carsten Borwieck
Abstract: Various embodiments of the teachings herein include a method for operating an electronics production line for producing electronic assemblies. The electronics production line comprises a device to apply joining material onto component carriers, an assembly device to place electronic components onto the component carriers, a joining device to join the electronic components to the component carriers, and a transport to transport the component carriers through the production line. An example method includes: transporting a process parameter acquisition system through the electronics production line on the transport; measuring actual process parameter values with the process parameter acquisition system; providing setpoint process parameter values; determining any deviations between actual and setpoint process parameter values; and providing a dataset including the deviations.
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公开(公告)号：US20250061564A1
公开(公告)日：2025-02-20
申请号：US18807656
申请日：2024-08-16
Applicant: Siemens Aktiengesellschaft
Inventor： Ulrich Wittreich , Rene Blank , Michael Hanisch , Marco Matiwe , Dennis Sommerfeld , Kay Jarchoff , Bernd Müller
Abstract: Various embodiments of the teachings herein include a method for monitoring a flux application in a soldering process. An example includes: defining flux wetting surfaces in relation to an image of an application surface; generating a thermographic recording of the application surface selectively provided with liquid flux; defining adjustment points on the application surface which can be identified on the image and on the thermographic recording; superimposing the image and the thermographic recording on the basis of the adjustment points; and comparing the position of temperature anomalies on the application surface identified by the thermographic recording with the position of the flux wetting surfaces on the image.
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公开(公告)号：US09986648B2
公开(公告)日：2018-05-29
申请号：US15561338
申请日：2016-03-29
Inventor： Michael Hanisch , Heiko Huth , Wolfgang Ludeck , Bernd Mueller , Mathias Nowottnick , Andrey Prihodovsky , Dirk Seehase , Ulrich Wittreich , Dirk Wormuth
IPC: H05K3/34 , H05K1/18 , B23K1/00 , B23K1/008 , B23K101/42
CPC classification number: H05K3/341 , B23K1/0006 , B23K1/0016 , B23K1/008 , B23K2101/42 , H05K1/181 , H05K3/225 , H05K3/3415 , H05K3/3494 , H05K2203/1163 , H05K2203/176
Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
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公开(公告)号：US20180110131A1
公开(公告)日：2018-04-19
申请号：US15561338
申请日：2016-03-29
Inventor： Michael Hanisch , Heiko Huth , Wolfgang Ludeck , Bernd Mueller , Mathias Nowottnick , Andrey Prihodovsky , Dirk Seehase , Ulrich Wittreich , Dirk Wormuth
CPC classification number: H05K3/341 , B23K1/0006 , B23K1/0016 , B23K1/008 , B23K2101/42 , H05K1/181 , H05K3/225 , H05K3/3415 , H05K3/3494 , H05K2203/1163 , H05K2203/176
Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
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