公开(公告)号：US20240053113A1

公开(公告)日：2024-02-15

申请号：US18268140

申请日：2021-12-01

Applicant: Siemens Aktiengesellschaft

Inventor： VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  FLORIAN SCHWARZ

IPC: F28F13/10 ,  H05K7/20

CPC classification number: F28F13/10 ,  H05K7/20936 ,  H05K7/20336

Abstract: A heat pipe heat sink operating as a pulsating heat pipe includes a body comprising internally a closed channel in which a fluid is arranged such that part of the fluid is present in gaseous form. The channel has a periphery which is designed to be smooth. The body includes a first body portion which is embodied as curved, alternatingly curved, serpentine or U-shaped. A coolant, in particular a gaseous coolant, flows through the first body portion along a surface of the first body portion, wherein portions of the channel are arranged parallel to one another and/or in the presence of more than one channel, different channels are arranged parallel to one another. The body is composed of two block parts, with parts of the channel being arranged on a boundary area of the two block parts, respectively.

公开(公告)号：US20210067368A1

公开(公告)日：2021-03-04

申请号：US16961589

申请日：2018-12-18

Applicant: Siemens Aktiengesellschaft

Inventor： Ludwig KRAUS ,  CHRISTIAN MAUL ,  VOLKER MÜLLER

IPC: H04L12/40

Abstract: A signal transmission apparatus has several serially-connected signal distribution modules, wherein interfaces of two adjacent signal distribution modules are each interconnected by a signal bridge. The signal transmission apparatus also has at least one direct connection between two signal distribution modules, which is routed through all signal bridges arranged between the two adjacent signal distribution modules and interconnects the interfaces of the adjacent signal bridges. In addition, a signal transmission bus is routed through all signal bridges and via all interfaces. The interfaces of all signal distribution modules have an identical design and all signal bridges connect two interfaces in the same way.

公开(公告)号：US20230307250A1

公开(公告)日：2023-09-28

申请号：US18125442

申请日：2023-03-23

Applicant: Siemens Aktiengesellschaft

Inventor： PHILIPP KNEISSL ,  FLORIAN SCHWARZ ,  VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  VLADIMIR DANOV

IPC: H01L21/48 ,  H01L23/427

CPC classification number: H01L21/4871 ,  H01L23/427 ,  H01L24/48 ,  H01L2224/48247

Abstract: In a method for producing an apparatus for cooling a semiconductor arrangement, a first cooling channel is produced in a metal body with a first FSC (Friction Stir Channeling) at a first depth from a surface of the metal body. Using the first FSC method, a first connecting channel is produced extending from the first cooling channel to the surface of the metal body. Using second FSC method a second cooling channel is produced in the metal body at a second depth from the surface of the metal body, with the second depth being smaller than the first depth. The first connecting channel forms a fluidic connection between the first cooling channel and the second cooling channel, and the first and second cooling channels and the first connecting channel form a cooling channel structure.

公开(公告)号：US20240414894A1

公开(公告)日：2024-12-12

申请号：US18696740

申请日：2022-09-16

Applicant: Siemens Aktiengesellschaft

Inventor： VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  FLORIAN SCHWARZ ,  VLADIMIR DANOV ,  STEFAN STEGMEIER

IPC: H05K7/20

Abstract: A mount includes a first metal element having a first surface for connection to a heat source, and a second metal element having a second surface for connection to a heat sink. A body made of plastic, glass or ceramic is arranged so as to abut against the first and second metal elements. The body includes through-openings which extend from a region of the first surface to a region of the second surface. The mount includes grooves in the region of the first surface and in the region of the second surface. The grooves extend over two of the through-openings. The first and second metal elements are arranged on the body such that a closed cooling channel is formed by the through-openings, the grooves and the first and second metal elements.

公开(公告)号：US20240363487A1

公开(公告)日：2024-10-31

申请号：US18287788

申请日：2022-03-25

Applicant: Siemens Aktiengesellschaft

Inventor： VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  FLORIAN SCHWARZ

IPC: H01L23/427 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/427 ,  H01L21/4875 ,  H01L21/4882 ,  H01L24/40 ,  H01L25/0655 ,  H01L2224/40225 ,  H01L2924/1815

Abstract: A semiconductor module includes a heat sink, a substrate connected to the heat sink, a semiconductor component in contact with the substrate, and a planar cooling element designed to include a hermetically sealed duct structure for arrangement of a heat transport medium such that the hermetically sealed duct structure and the heat transport medium form a pulsating heat pipe. The planar cooling element is designed to establish a thermal connection between a substrate-distal side of the semiconductor component and the heat sink and to have a shape which is adapted to a height profile of a circuit layout having height offsets.

公开(公告)号：US20250118627A1

公开(公告)日：2025-04-10

申请号：US18728617

申请日：2022-11-02

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Hans Knauer ,  VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  FLORIAN SCHWARZ

IPC: H01L23/427

Abstract: A hybrid heat sink includes a pulsating heat pipe and a liquid cooling unit which Includes a cover, with the pulsating heat pipe and the liquid cooling unit being arranged in layers on top of one another. The pulsating heat pipe is located between a heat source and the liquid cooling unit and is integrated in the cover of the liquid cooling unit.

公开(公告)号：US20250112118A1

公开(公告)日：2025-04-03

申请号：US18839996

申请日：2023-01-30

Applicant: Siemens Aktiengesellschaft

Inventor： VLADIMIR DANOV ,  PHILIPP KNEISSL ,  VOLKER MÜLLER ,  STEPHAN NEUGEBAUER ,  FLORIAN SCHWARZ

IPC: H01L23/40 ,  H01L21/48 ,  H01L23/427

Abstract: A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-fit connection, in particular a screw connection. The busbar includes a cover plate and a closed cooling channel structure with a cooling channel which is produced at least partially by an FSC (Friction Stir Channeling) method and arranged to run through the cover plate.