公开(公告)号：US20230335511A1

公开(公告)日：2023-10-19

申请号：US18340366

申请日：2023-06-23

申请人： Silego Technology Inc.

发明人： John McDonald ,  Tom Truong ,  David Kunteh Chow

IPC分类号： H01L23/64 ,  H01L23/498

CPC分类号： H01L23/645 ,  H01L23/49838 ,  H01L28/10 ,  H01L23/49894

摘要： A packaging substrate and a method for mounting an integrated circuit and/or a circuit component is presented. The packaging substrate includes an upper surface for mounting the integrated circuit and/or circuit component; a lower surface opposite to the upper surface, wherein the lower surface is for mounting to a printed circuit board (PCB); a non-conductive material; wherein the non-conductive material is a plastic: an inductor structure at least partially embedded in the non-conductive material; first and second conductive materials, and conductive pillars, arranged to form a first coil and a second coil having an inductance; wherein the first coil and second coil are arranged as a toroid transformer wound in a double helix configuration.