公开(公告)号：US09269677B2

公开(公告)日：2016-02-23

申请号：US14531226

申请日：2014-11-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。

公开(公告)号：US20150050782A1

公开(公告)日：2015-02-19

申请号：US14531226

申请日：2014-11-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。