公开(公告)号：US11476572B2

公开(公告)日：2022-10-18

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US20180047711A1

公开(公告)日：2018-02-15

申请号：US15352942

申请日：2016-11-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Liang Shih ,  Jia-Huei Hung ,  Chia-Yang Chen ,  Yueh-Chiung Chang

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic stack structure is provided, including a first substrate, a second substrate stacked on the first substrate through a plurality of passive elements, and an electronic element disposed on at least one of the first substrate and the second substrate. As such, the distance between the first substrate and the second substrate is defined by the height and size of the passive elements. The present disclosure further provides a method for fabricating the electronic stack structure.

公开(公告)号：US20200161756A1

公开(公告)日：2020-05-21

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01Q1/24 ,  H01Q9/42

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US20180090835A1

公开(公告)日：2018-03-29

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/48 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01Q1/526 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01L2924/00014

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US20170048981A1

公开(公告)日：2017-02-16

申请号：US14998114

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Chueh Hu ,  Yueh-Chiung Chang ,  Don-Son Jiang

IPC: H05K1/18

CPC classification number: H01L25/117 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.

Abstract translation: 提供了一种电子模块，其包括堆叠在第一包装上的第一包装和第二包装。 第一封装具有密封剂和嵌入密封剂中的电子元件。 第二封装具有绝缘层和形成在绝缘层上并延伸穿过绝缘层的天线结构。 绝缘层被结合到密封剂上，天线结构电连接到电子元件。 由于具有天线结构的第二封装堆叠在第一封装上，所以本发明不需要增加用于安装天线结构的第一封装的面积，因此允许电子模块满足小型化要求。

公开(公告)号：US20150050782A1

公开(公告)日：2015-02-19

申请号：US14531226

申请日：2014-11-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。

公开(公告)号：US10587041B2

公开(公告)日：2020-03-10

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01L23/552 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US10115712B2

公开(公告)日：2018-10-30

申请号：US14998114

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Chueh Hu ,  Yueh-Chiung Chang ,  Don-Son Jiang

IPC: H01L25/11 ,  H05K7/02 ,  H01Q3/44

Abstract: An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.

公开(公告)号：US09269677B2

公开(公告)日：2016-02-23

申请号：US14531226

申请日：2014-11-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。