公开(公告)号：US20200350285A1

公开(公告)日：2020-11-05

申请号：US16554779

申请日：2019-08-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

公开(公告)号：US12125828B2

公开(公告)日：2024-10-22

申请号：US18464855

申请日：2023-09-11

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5226 ,  H01L24/13 ,  H01L2225/06541

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

公开(公告)号：US11923337B2

公开(公告)日：2024-03-05

申请号：US16554779

申请日：2019-08-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Bo-Hao Ma ,  Yu-Ting Xue ,  Ching-Hung Tseng ,  Guan-Hua Lu ,  Hong-Da Chang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/522 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5226 ,  H01L24/13 ,  H01L2225/06541

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.