T-FLEX BONDER
    1.
    发明申请

    公开(公告)号:US20140069567A1

    公开(公告)日:2014-03-13

    申请号:US13609248

    申请日:2012-09-10

    IPC分类号: H05K3/32 B32B41/00

    摘要: A flexible circuit with multiple independent mounting points can be mounted (soldered) to substrates by independently (and concurrently) positioning mounting points in x, y, and theta (angular rotation) with vacuum chucks. In one embodiment the vacuum chucks can be guided by computer aided vision to locate and match fiducials on the flex circuit with fiducials on the substrate. In one embodiment, hot bars can be used in a subsequent bonding operation to secure an adhesive coupling between the flexible circuits and the substrate.

    摘要翻译: 具有多个独立安装点的柔性电路可以通过独立(并且同时)通过真空吸盘将安装点定位在x,y和θ(角度旋转)中来安装(焊接)到基板。 在一个实施例中,真空卡盘可以由计算机辅助视觉引导,以便在基板上的基准点上定位和匹配柔性电路上的基准。 在一个实施例中,热棒可以用于随后的接合操作中,以确保柔性电路和衬底之间的粘合剂耦合。