Process for making air bridges for integrated circuits
    1.
    发明授权
    Process for making air bridges for integrated circuits 失效
    集成电路制作空气桥的工艺

    公开(公告)号:US5408742A

    公开(公告)日:1995-04-25

    申请号:US141474

    申请日:1993-10-22

    IPC分类号: H01L23/522 H05K3/02

    摘要: The invention relates to an air bridge and an evaporative process for making air bridges. A first layer of photoresist is patterned to create two openings over the contacts to be connected, separated by a strip of photoresist. The photoresist strip is hard baked to allow it to soften and to cause further cross linking. The softening allows surface tension to reshape the photoresist strip to create a gradually sloping arcuate surface between contact openings upon which a metal layer of nearly constant thickness may be evaporated. A second layer of photoresist is then applied, and patterned to create a single large opening embracing both contacts and the now arcuate hard baked photoresist strip. An arch within the large opening connecting both contacts is formed by evaporation. Excess metal and both photoresist layers are then removed, leaving a novel, arch shaped air bridge.

    摘要翻译: 本发明涉及一种用于制造空气桥的空气桥和蒸发过程。 图案化的第一层光致抗蚀剂在要连接的触点上形成两个开口,由光致抗蚀剂条隔开。 光致抗蚀剂条被硬烘烤以使其软化并进一步交联。 软化允许表面张力重新形成光致抗蚀剂条,以在接触开口之间产生逐渐倾斜的弓形表面,在其上可以蒸发几乎恒定厚度的金属层。 然后施加第二层光致抗蚀剂,并图案化以形成包含两个触点和现在的弧形硬烘烤光刻胶条的单个大开口。 通过蒸发形成连接两个触点的大开口内的拱形。 然后去除过量的金属和两个光致抗蚀剂层,留下一个新颖的拱形空气桥。