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公开(公告)号:US20160341919A1
公开(公告)日:2016-11-24
申请号:US15136229
申请日:2016-04-22
发明人: Daming Liu , John Zyskind
CPC分类号: G02B6/4243 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4202 , G02B6/4214 , G02B6/4225 , G02B6/4226 , G02B6/4239
摘要: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
摘要翻译: V沟槽组件用于将透镜光纤(例如,由二氧化硅制成的光纤)与光子芯片中的波导连接。 V型槽组件由熔融二氧化硅制成。 使用熔融二氧化硅使得用于将透镜纤维粘合到V形槽组件和/或将V形槽组件粘合到光子芯片上的粘合剂(例如,环氧树脂)可以至少部分地被光固化 。
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公开(公告)号:US20150346429A1
公开(公告)日:2015-12-03
申请号:US14722970
申请日:2015-05-27
发明人: Damien Lambert , Nikhil Kumar , Elton Marchena , Daming Liu , Guoliang Li , John Zyskind
CPC分类号: G02B6/14 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/305 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/12147 , G02B2006/12152
摘要: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder made of crystalline silicon and a ridge made of non-crystalline silicon (e.g., amorphous silicon). In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages have different widths and/or thicknesses at a given cross section.
摘要翻译: 波导模式扩展器将半导体波导中较小的光学模式耦合到光纤中较大的光学模式。 波导模式扩展器包括由晶体硅制成的肩部和由非晶硅(例如非晶硅)制成的脊。 在一些实施例中,波导模式扩展器的脊具有多个级,多个级在给定横截面处具有不同的宽度和/或厚度。
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公开(公告)号:US09348094B1
公开(公告)日:2016-05-24
申请号:US14857580
申请日:2015-09-17
发明人: Daming Liu , John Zyskind
CPC分类号: G02B6/4243 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/4202 , G02B6/4214 , G02B6/4225 , G02B6/4226 , G02B6/4239
摘要: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
摘要翻译: V沟槽组件用于将透镜光纤(例如,由二氧化硅制成的光纤)与光子芯片中的波导连接。 V型槽组件由熔融二氧化硅制成。 使用熔融二氧化硅使得用于将透镜纤维粘合到V形槽组件和/或将V形槽组件粘合到光子芯片上的粘合剂(例如,环氧树脂)可以至少部分地被光固化 。
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公开(公告)号:US10107976B2
公开(公告)日:2018-10-23
申请号:US15136229
申请日:2016-04-22
发明人: Daming Liu , John Zyskind
摘要: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
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公开(公告)号:US09885832B2
公开(公告)日:2018-02-06
申请号:US14722970
申请日:2015-05-27
发明人: Damien Lambert , Nikhil Kumar , Elton Marchena , Daming Liu , Guoliang Li , John Zyskind
CPC分类号: G02B6/14 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/305 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/12147 , G02B2006/12152
摘要: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder made of crystalline silicon and a ridge made of non-crystalline silicon (e.g., amorphous silicon). In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages have different widths and/or thicknesses at a given cross section.
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公开(公告)号:US20190170953A1
公开(公告)日:2019-06-06
申请号:US16140006
申请日:2018-09-24
发明人: Daming Liu , John Zyskind
摘要: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
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