公开(公告)号：US20040155332A1

公开(公告)日：2004-08-12

申请号：US10364549

申请日：2003-02-10

申请人： Skyworks Solutions, Inc.

发明人： Sandra L. Petty-Weeks ,  Patrick L. Welch

IPC分类号： H01L023/48

CPC分类号： H01L24/32 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： In one exemplary embodiment, a structure comprises a substrate having a top surface, and a die attach pad situated on the top surface of the substrate. The die attach pad includes a die attach region and at least one substrate ground pad region electrically connected to the die attach region. The die attach pad further includes a die attach stop between the die attach region and the at least one substrate ground pad region. The die attach stop acts to control and limit die attach adhesive flow out to the at least one substrate ground pad region during packaging so that the at least one substrate ground pad region can be moved closer to die attach region so that shorter bond wires for connecting the at least one substrate ground pad region to a die wire bond pad may be used during packaging.

摘要翻译： 在一个示例性实施例中，结构包括具有顶表面的衬底和位于衬底的顶表面上的管芯附接焊盘。 管芯附接焊盘包括管芯附接区域和电连接到管芯附着区域的至少一个衬底接地焊盘区域。 管芯附接垫还包括在管芯附着区域和至少一个衬底接地焊盘区域之间的管芯连接止动件。 管芯附着止动器用于在包装期间控制和限制管芯附着粘合剂流出到至少一个衬底接地焊盘区域，使得至少一个衬底接地焊盘区域能够靠近管芯附着区域移动，从而使用于连接的较短接合线 在封装期间可以使用至芯片接合焊盘的至少一个衬底接地焊盘区域。