公开(公告)号：US20240194543A1

公开(公告)日：2024-06-13

申请号：US18442973

申请日：2024-02-15

Applicant: Socionext Inc.

Inventor： Kosuke KUSUMI

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/522 ,  H01L23/528 ,  H01L23/538 ,  H01L25/10

CPC classification number: H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor device includes a substrate; and a plurality of semiconductor elements each including a first terminal and a second terminal connected to the substrate, and an internal wiring connecting the first terminal and the second terminal to each other. A wiring path is provided to sequentially connect the plurality of semiconductor elements, by connecting the first terminal of each of the plurality of semiconductor elements to the second terminal of another one of the plurality of semiconductor elements via a substrate wiring provided in the substrate. One of the plurality of semiconductor elements includes a determination circuit provided on a path of the internal wiring. The determination circuit is configured to transmit a determination signal to the first terminal, and determine an abnormality of the wiring path based on the determination signal received by the second terminal via the wiring path.