公开(公告)号：US09271087B1

公开(公告)日：2016-02-23

申请号：US14505495

申请日：2014-10-02

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Chih-Hsien Chung ,  Yong-Wei Chen ,  Jhyy-Cheng Liou

IPC: H04R25/00 ,  H04R23/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R23/006 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

Abstract translation: MEMS麦克风封装器件包括作为集成电路芯片的MEMS麦克风芯片。 声学感测结构嵌入在集成电路芯片中。 粘合剂结构粘附在麦克风芯片的外侧壁上。 粘合剂结构的底部从麦克风芯片的第一表面突出出来并粘附在具有互连结构的基板的表面上，以形成第一密封环。 在声学检测结构和衬底之间并由第一密封环密封的空间形成第二腔室。 盖子粘附到粘合剂结构的顶部，覆盖在麦克风芯片的第二表面上的空腔上。 粘合剂结构的顶部形成为第二密封环。 所述盖和麦克风芯片的第二表面之间的空间被第二密封环密封形成第一腔室。