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Patent Agency Ranking
公开(公告)号：US20200068317A1
公开(公告)日：2020-02-27
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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公开(公告)号：US11206495B2
公开(公告)日：2021-12-21
申请号：US16677622
申请日：2019-11-07
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee
Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.
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公开(公告)号：US10728674B2
公开(公告)日：2020-07-28
申请号：US16112777
申请日：2018-08-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee , Jhyy-Cheng Liou
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.
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公开(公告)号：US20210144485A1
公开(公告)日：2021-05-13
申请号：US16677622
申请日：2019-11-07
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Li-Chi Tsao , Chien-Hsing Lee
Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.
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公开(公告)号：US20140318213A1
公开(公告)日：2014-10-30
申请号：US13929810
申请日：2013-06-28
Applicant: Solid State System Co., Ltd.
Inventor： Li-Chi Tsao , Chien-Hsing Lee
IPC: G01N29/30
CPC classification number: G01N29/30 , G01N29/14 , G01N29/4436 , G01N2291/0231
Abstract: An acoustic micro-device testing apparatus including an acoustic device, at least one device under test (DUT), and a bearing plate is disclosed. The acoustic device provides a testing acoustic source to a first side of the DUT through the main channel and to a second side of the DUT through the side channel. The bearing plate has a first surface and a second surface. The first surface has a chamber sunken into the bearing plate. The second surface has a bearing space sunken into the bearing plate and bearing the DUT. The bearing plate has a main channel connecting the chamber and the DUT and at least one side channel connecting the chamber and the bearing space directly or through the main channel. A cover unit covers the bearing plate so that the bearing space and the chamber form a confined space. The DUT is in the confined space.
Abstract translation: 公开了一种包括声学装置，至少一个被测器件（DUT）和支承板的声学微器件测试装置。 声学装置通过主通道向DUT的第一侧提供测试声源，并通过侧通道向DUT的第二侧提供测试声源。 支承板具有第一表面和第二表面。 第一个表面有一个凹入承载板的腔室。 第二个表面有一个轴承空间沉入轴承板并承载DUT。 轴承板具有连接腔室和DUT的主通道以及直接或通过主通道连接腔室和轴承空间的至少一个侧通道。 盖单元覆盖轴承板，使得轴承空间和腔室形成密闭空间。 DUT位于密闭空间。
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