公开(公告)号：US12075593B2

公开(公告)日：2024-08-27

申请号：US17910485

申请日：2020-09-24

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Keiichi Aoki ,  Yasuhiro Ootori ,  Yuta Tamaki ,  Mitsuharu Morishita

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20336 ,  H05K7/2039

Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.

公开(公告)号：US20230345665A1

公开(公告)日：2023-10-26

申请号：US18249573

申请日：2021-11-01

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Masanori Hayashibara ,  Yasuhiro Ootori ,  Keiichi Aoki

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20136

Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.

公开(公告)号：US20220262759A1

公开(公告)日：2022-08-18

申请号：US17427759

申请日：2020-02-03

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Kenji Hirose ,  Masanori Hayashibara ,  Tetsuji Tamura ,  Sei Oonishi ,  Nobuyuki Sugawara

IPC: H01L23/00 ,  H01L23/10 ,  H01L25/16

Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).