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1.发明申请Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die 有权半导体器件和使用具有与半导体芯片相同宽度的分配针形成模具底部填充物的方法公开(公告)号：US20120061858A1
公开(公告)日：2012-03-15
申请号：US12882083
申请日：2010-09-14
申请人： SooMoon Park , ByoungWook Jang , DongSoo Moon
发明人： SooMoon Park , ByoungWook Jang , DongSoo Moon
CPC分类号： H01L21/54 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
摘要翻译： 半导体器件具有安装在衬底的表面上的半导体管芯。 模具底部填充分配针的宽度基本上等于半导体管芯的宽度。 分配针与半导体管芯的一侧流体连通。 将分注针的出口从半导体管芯的宽度均匀地沉积到半导体管芯和衬底之间的区域中，而不会发生分配针的移动。 分配针具有柄和T形构件的出口。 分配针可以在柄和出口之间具有多个极部。 分配针具有在柄和出口之间的板。 出口具有长度基本上等于或大于出口下边缘长度的上边缘。
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2.发明授权Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die 有权半导体装置以及使用与半导体芯片相同宽度的分配针形成模具底部填充物的方法公开(公告)号：US08193036B2
公开(公告)日：2012-06-05
申请号：US12882083
申请日：2010-09-14
申请人： SooMoon Park , ByoungWook Jang , DongSoo Moon
发明人： SooMoon Park , ByoungWook Jang , DongSoo Moon
IPC分类号： H01L21/00
CPC分类号： H01L21/54 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
摘要翻译： 半导体器件具有安装在衬底的表面上的半导体管芯。 模具底部填充分配针的宽度基本上等于半导体管芯的宽度。 分配针与半导体管芯的一侧流体连通。 将分注针的出口从半导体管芯的宽度均匀地沉积到半导体管芯和衬底之间的区域中，而不会发生分配针的移动。 分配针具有柄和T形构件的出口。 分配针可以在柄和出口之间具有多个极部。 分配针具有在柄和出口之间的板。 出口具有长度基本上等于或大于出口下边缘长度的上边缘。
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公开(公告)号：US20120211904A1
公开(公告)日：2012-08-23
申请号：US13458289
申请日：2012-04-27
申请人： SooMoon Park , ByoungWook Jang , DongSoo Moon
发明人： SooMoon Park , ByoungWook Jang , DongSoo Moon
CPC分类号： H01L21/54 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
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4.发明授权Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die 有权半导体装置以及使用与半导体芯片相同宽度的分配针形成模具底部填充物的方法公开(公告)号：US08569895B2
公开(公告)日：2013-10-29
申请号：US13458289
申请日：2012-04-27
申请人： SooMoon Park , ByoungWook Jang , DongSoo Moon
发明人： SooMoon Park , ByoungWook Jang , DongSoo Moon
CPC分类号： H01L21/54 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A semiconductor device has a semiconductor die mounted over a surface of a substrate. A mold underfill dispensing needle has a width substantially equal to a width of the semiconductor die. The dispensing needle is placed in fluid communication with a side of the semiconductor die. A mold underfill is deposited from an outlet of the dispensing needle evenly across a width of the semiconductor die into an area between the semiconductor die and substrate without motion of the dispensing needle. The dispensing needle has a shank and the outlet in a T-configuration. The dispensing needle can have a plurality of pole portions between a shank and the outlet. The dispensing needle has a plate between a shank and the outlet. The outlet has an upper edge with a length substantially equal to or greater than a length of a lower edge of the outlet.
摘要翻译： 半导体器件具有安装在衬底的表面上的半导体管芯。 模具底部填充分配针的宽度基本上等于半导体管芯的宽度。 分配针与半导体管芯的一侧流体连通。 将分注针的出口从半导体管芯的宽度均匀地沉积到半导体管芯和衬底之间的区域中，而不会发生分配针的移动。 分配针具有柄和T形构件的出口。 分配针可以在柄和出口之间具有多个极部。 分配针具有在柄和出口之间的板。 出口具有长度基本上等于或大于出口下边缘长度的上边缘。
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