公开(公告)号：US20100225991A1

公开(公告)日：2010-09-09

申请号：US12782418

申请日：2010-05-18

申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

IPC分类号： G02B26/00

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

公开(公告)号：US08184356B2

公开(公告)日：2012-05-22

申请号：US12782386

申请日：2010-05-18

申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

IPC分类号： G02B26/00

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

摘要翻译： 微型薄膜结构，微机电系统（MEMS）开关及其制造方法。 该微薄膜结构包括至少两层具有不同性质的薄膜并依次层叠以形成上层和下层，其中上层和下层之间的界面形成为至少朝两个方向取向。 微型薄膜结构和形成方法可以应用于MEMS开关的可动电极。 薄膜结构可以通过在下层中形成通孔而形成，并且以接合在通孔中的形式沉积上层。 或者，薄膜结构可以通过在下层的顶侧上形成突起和凹陷部分，然后将上层沉积在具有突出部分和凹陷部分的下层的顶侧上而制成。

公开(公告)号：US20100225990A1

公开(公告)日：2010-09-09

申请号：US12782386

申请日：2010-05-18

申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

IPC分类号： G02B26/00

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

摘要翻译： 微型薄膜结构，微机电系统（MEMS）开关及其制造方法。 该微薄膜结构包括至少两层具有不同性质的薄膜并依次层叠以形成上层和下层，其中上层和下层之间的界面形成为至少朝两个方向取向。 微型薄膜结构和形成方法可以应用于MEMS开关的可动电极。 薄膜结构可以通过在下层中形成通孔而形成，并且以接合在通孔中的形式沉积上层。 或者，薄膜结构可以通过在下层的顶侧上形成突起和凹陷部分，然后将上层沉积在具有突出部分和凹陷部分的下层的顶侧上而制成。

公开(公告)号：US07746536B2

公开(公告)日：2010-06-29

申请号：US11230502

申请日：2005-09-21

申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

IPC分类号： G02B26/00 ,  H02N2/00

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

摘要翻译： 微型薄膜结构，微机电系统（MEMS）开关及其制造方法。 该微薄膜结构包括至少两层具有不同性质的薄膜并依次层叠以形成上层和下层，其中上层和下层之间的界面形成为至少朝两个方向取向。 微型薄膜结构和形成方法可以应用于MEMS开关的可动电极。 薄膜结构可以通过在下层中形成通孔而形成，并且以接合在通孔中的形式沉积上层。 或者，薄膜结构可以通过在下层的顶侧上形成突起和凹陷部分，然后将上层沉积在具有突出部分和凹陷部分的下层的顶侧上而制成。

公开(公告)号：US20060087716A1

公开(公告)日：2006-04-27

申请号：US11230502

申请日：2005-09-21

申请人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

发明人： Soon-cheol Kweon ,  Hyung-jae Shin ,  Byung-hee Jeon ,  Seok-kwan Hong ,  Che-heung Kim ,  Sang-hun Lee

IPC分类号： G02B26/00

CPC分类号： H01H59/0009 ,  H01H1/0036

摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

摘要翻译： 微型薄膜结构，微机电系统（MEMS）开关及其制造方法。 该微薄膜结构包括至少两层具有不同性质的薄膜并依次层叠以形成上层和下层，其中上层和下层之间的界面形成为至少朝两个方向取向。 微型薄膜结构和形成方法可以应用于MEMS开关的可动电极。 薄膜结构可以通过在下层中形成通孔而形成，并且以接合在通孔中的形式沉积上层。 或者，薄膜结构可以通过在下层的顶侧上形成突起和凹陷部分，然后将上层沉积在具有突出部分和凹陷部分的下层的顶侧上而制成。

公开(公告)号：US07911300B2

公开(公告)日：2011-03-22

申请号：US12697629

申请日：2010-02-01

申请人： Il-jong Song ,  Dong-ha Shim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Che-heung Kim ,  Sang-hun Lee ,  Young-tack Hong

发明人： Il-jong Song ,  Dong-ha Shim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Che-heung Kim ,  Sang-hun Lee ,  Young-tack Hong

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H2059/0018

摘要： A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.

摘要翻译： 提供了用于控制AC信号的传输的接通/断开的MEMS RF开关。 本发明的MEMS RF开关包括：耦合到电源的一个端子的第一电极; 与所述第一电极的上表面组合的半导体层，并且当从所述电源施加偏置信号时，形成电位势垒以变得绝缘; 以及第二电极，设置在距离半导体层预定距离处，并且耦合到电源的另一个端子，其中当从电源施加偏置信号时，第二电极接触半导体层。 因此，尽管偏置信号可能不会被切断，但自由电子和空穴在半导体层中重新结合，从而可以防止电荷积累和粘附。

公开(公告)号：US07420135B2

公开(公告)日：2008-09-02

申请号：US11322267

申请日：2006-01-03

申请人： Sang-hun Lee ,  Soon-cheol Kweon ,  Che-heung Kim ,  Hyung-jae Shin

发明人： Sang-hun Lee ,  Soon-cheol Kweon ,  Che-heung Kim ,  Hyung-jae Shin

IPC分类号： H01H57/00 ,  H01H21/22 ,  H01P1/10 ,  G02B26/08 ,  G02B26/00

CPC分类号： H01H59/0009

摘要： A micro electro-mechanical system (MEMS) switch and a method for manufacturing the same are provided. The MEMS switch includes a substrate; signal lines formed on the substrate; main electrodes spaced apart by a distance and formed over the substrate; an actuating beam installed above the main electrodes at a certain height; a support unit to support the actuating beam; and sub-electrodes formed above the actuating beam at a distance from the actuating beam and facing the corresponding main electrodes. The method includes depositing and patterning a metal layer on a substrate; depositing and patterning a sacrificial layer to form actuator beam support holes and first sub-electrode contact holes; depositing and patterning an actuating beam layer on the sacrificial layer, thereby forming spacers; depositing and patterning second sub-electrode contact holes from another sacrificial layer; depositing and patterning a sub-electrode layer on the sacrificial layer; and removing the two sacrificial layers.

摘要翻译： 提供微机电系统（MEMS）开关及其制造方法。 MEMS开关包括基板; 形成在基板上的信号线; 主电极隔开一段距离并形成在衬底上; 在一定高度安装在主电极之上的致动梁; 用于支撑致动梁的支撑单元; 以及形成在致动梁上方一定距离致动梁并面对相应主电极的子电极。 该方法包括在衬底上沉积和图案化金属层; 沉积和图案化牺牲层以形成致动器梁支撑孔和第一子电极接触孔; 沉积和图案化牺牲层上的致动束层，从而形成间隔物; 从另一牺牲层沉积和构图第二子电极接触孔; 在牺牲层上沉积和构图子电极层; 并去除两个牺牲层。

公开(公告)号：US20060144681A1

公开(公告)日：2006-07-06

申请号：US11322267

申请日：2006-01-03

申请人： Sang-hun Lee ,  Soon-cheol Kweon ,  Che-heung Kim ,  Hyung-jae Shin

发明人： Sang-hun Lee ,  Soon-cheol Kweon ,  Che-heung Kim ,  Hyung-jae Shin

IPC分类号： H01H57/00

CPC分类号： H01H59/0009

摘要： A micro electromechanical system (MEMS) switch and a method for manufacturing the same are provided. The MEMS switch includes a substrate; signal lines formed on the substrate; main electrodes spaced apart by a distance and formed over the substrate; an actuating beam installed above the main electrodes at a certain height; a support unit to support the actuating beam; and sub-electrodes formed above the actuating beam at a distance from the actuating beam and facing the corresponding main electrodes. The method includes depositing and patterning a metal layer on a substrate; depositing and patterning a sacrificial layer to form actuator beam support holes and first sub-electrode contact holes; depositing and patterning an actuating beam layer on the sacrificial layer, thereby forming spacers; depositing and patterning second sub-electrode contact holes from another sacrificial layer; depositing and patterning a sub-electrode layer on the sacrificial layer; and removing the two sacrificial layers.

摘要翻译： 提供了微机电系统（MEMS）开关及其制造方法。 MEMS开关包括基板; 形成在基板上的信号线; 主电极隔开一段距离并形成在衬底上; 在一定高度安装在主电极上方的致动梁; 用于支撑致动梁的支撑单元; 以及形成在致动梁上方一定距离致动梁并面对相应主电极的子电极。 该方法包括在衬底上沉积和图案化金属层; 沉积和图案化牺牲层以形成致动器梁支撑孔和第一子电极接触孔; 沉积和图案化牺牲层上的致动束层，从而形成间隔物; 从另一牺牲层沉积和构图第二子电极接触孔; 在牺牲层上沉积和构图子电极层; 并去除两个牺牲层。

公开(公告)号：US20060131147A1

公开(公告)日：2006-06-22

申请号：US11251804

申请日：2005-10-18

申请人： Che-heung Kim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Kyu-sik Kim ,  Sang-hun Lee

发明人： Che-heung Kim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Kyu-sik Kim ,  Sang-hun Lee

IPC分类号： H01H57/00 ,  H02N1/00

CPC分类号： H01H59/0009 ,  H01H2059/0054

摘要： A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.

公开(公告)号：US20060012940A1

公开(公告)日：2006-01-19

申请号：US11179460

申请日：2005-07-13

申请人： Il-jong Song ,  Dong-ha Shim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Che-heung Kim ,  Sang-hun Lee ,  Young-tack Hong

发明人： Il-jong Song ,  Dong-ha Shim ,  Hyung-jae Shin ,  Soon-cheol Kweon ,  Che-heung Kim ,  Sang-hun Lee ,  Young-tack Hong

IPC分类号： H01L21/683

CPC分类号： H01H59/0009 ,  H01H2059/0018

摘要： A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.

摘要翻译： 提供了用于控制AC信号的传输的接通/断开的MEMS RF开关。 本发明的MEMS RF开关包括：耦合到电源的一个端子的第一电极; 与所述第一电极的上表面组合的半导体层，并且当从所述电源施加偏置信号时，形成电位势垒以变得绝缘; 以及第二电极，设置在距离半导体层预定距离处，并且耦合到电源的另一个端子，其中当从电源施加偏置信号时，第二电极接触半导体层。 因此，尽管偏置信号可能不会被切断，但自由电子和空穴在半导体层中重新结合，从而可以防止电荷积累和粘附。