MEMS vacuum sensor based on the friction principle
    1.
    发明授权
    MEMS vacuum sensor based on the friction principle 失效
    基于摩擦原理的MEMS真空传感器

    公开(公告)号:US08186225B2

    公开(公告)日:2012-05-29

    申请号:US12301874

    申请日:2007-05-09

    IPC分类号: G01L11/00

    CPC分类号: G01L21/22

    摘要: The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded. The lowest pressures to be determined are in the range of 10−6 mbar.

    摘要翻译: 本发明涉及一种用于压力测量的传感器元件,具有基板(5)和至少一个质量元件(1),其与基板(5)间隔开并且以振荡方式连接到基板(5) )和/或相对于基板(5)固定的支撑体(6),使得在质量元件(1)和基板(5)之间形成间隙,其宽度可以通过 质量元件(1)。 至少一个凹部和/或至少一个衬套(4)位于限定间隙的衬底(5)的表面中,该凹槽用于减少通过气体或等离子体周围的质量元件的振荡的阻尼 质量元件(1)。 传感器元件特别用于测量真空范围内的压力的压力传感器。 通过使用根据本发明的传感器元件作为压力传感器,可以记录高达大气压力范围的最大压力。 要确定的最低压力在10-6毫巴的范围内。

    MEMS VACUUM SENSOR BASED ON THE FRICTION PRINCIPLE
    2.
    发明申请
    MEMS VACUUM SENSOR BASED ON THE FRICTION PRINCIPLE 失效
    基于摩擦原理的MEMS真空传感器

    公开(公告)号:US20100024562A1

    公开(公告)日:2010-02-04

    申请号:US12301874

    申请日:2007-05-09

    IPC分类号: G01L21/22

    CPC分类号: G01L21/22

    摘要: The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded. The lowest pressures to be determined are in the range of 10−6 mbar.

    摘要翻译: 本发明涉及一种用于压力测量的传感器元件,具有基板(5)和至少一个质量元件(1),其与基板(5)间隔开并且以振荡方式连接到基板(5) )和/或相对于基板(5)固定的支撑体(6),使得在质量元件(1)和基板(5)之间形成间隙,其宽度可以通过 质量元件(1)。 至少一个凹部和/或至少一个衬套(4)位于限定间隙的衬底(5)的表面中,该凹槽用于减少通过气体或等离子体周围的质量元件的振荡的阻尼 质量元件(1)。 传感器元件特别用于测量真空范围内的压力的压力传感器。 通过使用根据本发明的传感器元件作为压力传感器,可以记录高达大气压力范围的最大压力。 要确定的最低压力在10-6毫巴的范围内。

    Method for producing a torsion spring
    3.
    发明授权
    Method for producing a torsion spring 失效
    扭簧的制造方法

    公开(公告)号:US06863832B1

    公开(公告)日:2005-03-08

    申请号:US10031957

    申请日:2000-07-20

    摘要: A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180° and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.

    摘要翻译: 一种制造例如在微结构扭转弹簧/质量体系中读取旋转速度的硅扭转弹簧的方法。 与横向和垂直方向上相对较高的横向刚度相比,所生产的系统达到较低的扭转刚度。 该方法从晶片或晶片复合材料进行,并且在合适的掩模覆盖时,通过各向异性湿化学蚀刻形成具有V形横截面的弹簧,其优选地在整个晶片厚度上延伸并且仅由[111] 飞机 以这种方式制备的两个晶片或晶片复合体相对于彼此对称地旋转180°并且彼此相对地定向成反射镜,从而形成所需的X形横截面。