摘要:
One embodiment of the invention includes a method for preventing a plurality of electronic devices from being pulled out of an equipment rack simultaneously. The method includes determining with an electronic sensor module whether an electronic device of a plurality of electronic devices coupled to the equipment rack is being slid out of the equipment rack. Provided the electronic device is being slid out of the equipment rack, an electronic locking module prevents any remaining electronic device of the plurality of electronic devices from being slid out of the equipment rack. A determination is made as to whether the electronic device has been slid back into the equipment rack. Provided the electronic device has been slid back into the equipment rack, the prevention is deactivated.
摘要:
A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.
摘要:
An assembly comprises a voltage regulator module and a field-pluggable voltage converter module configured in an arrangement that interlocks with and optionally attaches to the voltage regulator module.
摘要:
A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).
摘要:
Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.
摘要:
Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
摘要:
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
摘要:
An electronic system, an apparatus for cooling an electronic system, an electronics cooling apparatus, and associated method use a clutch to operate a cooling fan. An electronics cooling fan for usage in cooling an electronic system comprises a clutch that disengages upon failure wherein the electronics cooling fan is configured to freewheel upon disengagement of the clutch.
摘要:
A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.