公开(公告)号：US5702179A

公开(公告)日：1997-12-30

申请号：US537513

申请日：1995-10-02

申请人： Steven C. Sidwell ,  George J. English ,  Robert L. Garrison ,  Ralph J. Johnson

发明人： Steven C. Sidwell ,  George J. English ,  Robert L. Garrison ,  Ralph J. Johnson

IPC分类号： H05B41/24 ,  F21S8/10 ,  F21V19/00 ,  F21V25/00 ,  H01J61/35 ,  H01J61/52 ,  F21V9/00

CPC分类号： F21S48/218 ,  F21S48/119 ,  F21V25/00 ,  H01J61/35 ,  H01J61/52 ,  F21S48/1109

摘要： A discharge lamp, such as a neon lamp or a subminiature fluorescent lamp, includes an elongated tubular lamp envelope containing a fill material for supporting a light-emitting discharge and electrodes mounted at opposite ends of the lamp envelope. A light-transmissive conductive coating on the lamp envelope substantially attenuates emission of RF energy. A conductor in electrical contact with the conductive coating couples the conductive coating to a reference potential, such as ground. The conductor may be a metal or conductive silicone strip in electrical contact with the conductive coating along the length of the lamp envelope. The discharge lamp may be connected to a ballast circuit by coaxial cables. The outer conductor of each coaxial cable is connected to the conductive coating to form a continuous RF shield. The conductive coating and/or the metal strip may be used for heating of the discharge lamp.

摘要翻译： 诸如氖灯或超小型荧光灯的放电灯包括细长的管状灯泡，其包含用于支撑发光放电的填充材料和安装在灯壳的相对端的电极。 灯壳上的透光导电涂层基本上衰减射频能量的发射。 与导电涂层电接触的导体将导电涂层耦合到参考电位，例如接地。 导体可以是沿着灯壳长度与导电涂层电接触的金属或导电硅胶条。 放电灯可以通过同轴电缆连接到镇流器电路。 每个同轴电缆的外导体连接到导电涂层以形成连续的RF屏蔽。 导电涂层和/或金属带可用于加热放电灯。

公开(公告)号：US07090386B2

公开(公告)日：2006-08-15

申请号：US10984457

申请日：2004-11-09

申请人： Charles M. Coushaine ,  Michael Tucker ,  Thomas Tessnow ,  Ralph J. Johnson ,  Steven C. Sidwell

发明人： Charles M. Coushaine ,  Michael Tucker ,  Thomas Tessnow ,  Ralph J. Johnson ,  Steven C. Sidwell

IPC分类号： F21V7/04

CPC分类号： G02B6/425 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/144 ,  H05K1/182

摘要： A high-density LED array (10) capable of presenting a density of X LEDs/unit area has a first printed circuit board (12) having X/2 LEDs/area and X/2 apertures arrayed therewith. A second printed circuit board (22) is spaced from the first printed circuit board (12) and has X/2 LEDs 28/unit area. The LEDs (28) on the second printed circuit board are aligned with the apertures (20) in the first printed circuit board. Each of the LEDs (28) on the second printed circuit board (22) has an optical fiber (30) associated therewith and each of the light guides (30) extends through one of the apterures (20). Each of the mounted LEDs on the first printed circuit board can have an optical fiber associated therewith and the light guides can be bundled to direct light to a remote source.

摘要翻译： 能够呈现X LED /单位面积的密度的高密度LED阵列（10）具有第一印刷电路板（12），其具有X / 2 LED /面积和与其排列的X / 2孔径。 第二印刷电路板（22）与第一印刷电路板（12）间隔开并且具有X / 2 LED 28 /单位面积。 第二印刷电路板上的LED（28）与第一印刷电路板中的孔（20）对齐。 第二印刷电路板（22）上的每个LED（28）具有与其相关联的光纤（30），并且每个光导（30）延伸穿过其中一个（20）。 第一印刷电路板上的每个安装的LED可以具有与之相关联的光纤，并且光束可以被捆扎以将光引导到远程源。

公开(公告)号：US06827469B2

公开(公告)日：2004-12-07

申请号：US10625819

申请日：2003-07-23

申请人： Charles M. Coushaine ,  Steven C. Sidwell ,  Thomas Tessnow

发明人： Charles M. Coushaine ,  Steven C. Sidwell ,  Thomas Tessnow

IPC分类号： F21V2900

CPC分类号： F21K9/232 ,  F21V3/061 ,  F21Y2107/00 ,  F21Y2115/10 ,  Y10S362/80

摘要： A solid-state lamp has a base formed to be received into a socket, and the base has a retainer receptacle formed therein. An axially extending support is fitted into the base. The support is formed of an electrically conductive, heat-sinking material and has a retainer engaging the retainer receptacle. An electrically insulating coating is formed on the support and electrically conductive traces are formed on the insulating coating. A plurality of solid-state light sources are formed on the support and are electrically connected to the traces, at least two of the traces providing electrical connection to the base whereby electrical connection can be made to the socket. The plurality of solid-state light sources are formed in a selected area of the support and in a preferred embodiment mimic the dual filaments of a prior art lamp.

公开(公告)号：US07683474B2

公开(公告)日：2010-03-23

申请号：US11058310

申请日：2005-02-14

申请人： Steven C. Sidwell

发明人： Steven C. Sidwell

IPC分类号： H01L23/34

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) assembly and a method of making the assembly, in which a container having an open top is provided with a two sets of holes through a bottom of the container, an electrically conductive heat sink is attached to the container bottom beneath the first set of holes, and in which an electrically conductive sheet is attached to the container bottom beneath the second set of holes, where the heat sink and sheet are isolated from each other. LEDs are placed in the first set of holes so that each has a first LED terminal on and adhered to an exposed part of the heat sink through the respective one of the first holes and in which a second LED terminal is connected via a wire lead to the sheet through a respective one of the second holes.

摘要翻译： 发光二极管（LED）组件和制造该组件的方法，其中具有开口顶部的容器通过容器的底部设置有两组孔，导电散热器附接到容器底部 在第一组孔之下，并且其中导电片附接到第二组孔下面的容器底部，其中散热器和片彼此隔离。 LED被放置在第一组孔中，使得每个具有第一LED端子并且通过相应的一个第一孔粘附到散热器的暴露部分，并且其中第二LED端子经由导线连接到 该片通过相应的一个第二孔。

公开(公告)号：US07086767B2

公开(公告)日：2006-08-08

申请号：US10843811

申请日：2004-05-12

申请人： Steven C. Sidwell ,  Charles M. Coushaine ,  Paul Lyman

发明人： Steven C. Sidwell ,  Charles M. Coushaine ,  Paul Lyman

IPC分类号： F21S8/10 ,  F21V21/00 ,  F21V7/04

CPC分类号： F21V3/00 ,  F21K9/232 ,  F21S43/14 ,  F21S43/195 ,  F21S45/47 ,  F21V29/58 ,  F21V29/763 ,  F21V29/767 ,  F21W2103/00 ,  F21Y2107/30 ,  F21Y2115/10

摘要： A solid-state light source 10 compatible with existing sockets normally reserved for filamented lamps may be formed with a hollow base 12 formed to mechanically and electrically adapt to a socket. A sub-assembly 14 adapted to cooperate with and fit into the hollow base 12 comprises a metal core 16 having a bulbous body 18 and a narrow, depending foot 20. A circuit board 22 substantially surrounds the metal core 16 on two sides. The board 22 is preferably formed from a flexible printed circuit board material capable of sustaining a bend radius of at least 0.25 inches (6 mm). Solid-state light sources 30, for example, light emitting diodes (LEDs) are mechanically and electrically connected to one side of the circuit board by suitable electrically conductive traces. A glass dome 34 covers the sub-assembly 14 after it is inserted into the hollow base 12 and is sealed thereto.

摘要翻译： 与通常保留用于灯丝灯的现有插座兼容的固态光源10可以形成有机械和电气适应插座的中空基座12。 适于与中空基座12配合并配合到其中的子组件14包括具有球形体18和窄的依赖脚20的金属芯16。 电路板22在两侧基本上围绕金属芯16。 板22优选地由能够维持至少0.25英寸（6mm）的弯曲半径的柔性印刷电路板材料形成。 例如，发光二极管（LED）的固态光源30通过合适的导电迹线机械地和电连接到电路板的一侧。 子组件14在将其插入中空基座12中并将其密封之后覆盖子组件14。