Packaging method and system for LEDs
    2.
    发明授权
    Packaging method and system for LEDs 有权
    LED的封装方法和系统

    公开(公告)号:US09431582B2

    公开(公告)日:2016-08-30

    申请号:US13468227

    申请日:2012-05-10

    摘要: A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.

    摘要翻译: 一种细长的LED封装,其被配置为处理具有窄宽度的宽电流,LED芯片安装区域位于封装内的中心对称位置,安装孔与安装区域等距离设置,其中多个封装可以布置成具有交替的阳极和阴极端 可以产生高功率密度辐射通量线的方式。 一些实施例包括位于LED芯片安装区域的另一侧上的电流密度管理区域。

    Packaging Method and System for LEDs
    3.
    发明申请
    Packaging Method and System for LEDs 有权
    LED的包装方法和系统

    公开(公告)号:US20130175551A1

    公开(公告)日:2013-07-11

    申请号:US13468227

    申请日:2012-05-10

    IPC分类号: H01L27/15 H01L33/48 H01L33/62

    摘要: A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.

    摘要翻译: 一种细长的LED封装,其被配置为处理具有窄宽度的宽电流,LED芯片安装区域位于封装内的中心对称位置,安装孔与安装区域等距离设置,其中多个封装可以布置成具有交替的阳极和阴极端 可以产生高功率密度辐射通量线的方式。 一些实施例包括位于LED芯片安装区域的另一侧上的电流密度管理区域。