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公开(公告)号:US5526867A
公开(公告)日:1996-06-18
申请号:US467482
申请日:1995-06-06
申请人: Steven D. Keck , Michael A. Rocazella , Peter M. Engelgau , Gregory E. Hannon , Danny R. White , Alan S. Nagelberg
发明人: Steven D. Keck , Michael A. Rocazella , Peter M. Engelgau , Gregory E. Hannon , Danny R. White , Alan S. Nagelberg
CPC分类号: C22C1/1015 , C04B35/652 , C04B37/021 , C22C1/1036 , C22C47/06 , H01L21/4803 , H01L23/14 , H01L23/3733 , C04B2235/70 , C04B2237/346 , C04B2237/40 , C04B2237/401 , C22C2001/1063 , H01L2924/0002
摘要: The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its performance or bonding capabilities.
摘要翻译: 本发明涉及形成用作电子包装或容器的大复合体。 大复合体通过自发渗透填充材料的可渗透物质或具有熔融基质金属的预成型体并将自发渗透的材料结合到至少一种第二材料如陶瓷或陶瓷容纳体或金属或金属含有体而形成。 此外,在渗透之前,将填料或预型体放置成与第二材料的至少一部分接触,使得在通过熔融基体金属渗透填充材料或预型体之后,将渗透的材料结合到所述第二材料,从而 形成大复合体。 然后可以通过根据本发明的技术来涂覆大复合体,以增强其性能或粘合能力。
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公开(公告)号:US5163499A
公开(公告)日:1992-11-17
申请号:US520936
申请日:1990-05-09
申请人: Marc S. Newkirk , Danny R. White , Christopher R. Kennedy , Alan S. Nagelberg , Michael K. Aghajanian , Robert J. Wiener , Steven D. Keck , John T. Burke , Peter M. Engelgau , Cheng-Tsin Lee , Michael A. Rocazella
发明人: Marc S. Newkirk , Danny R. White , Christopher R. Kennedy , Alan S. Nagelberg , Michael K. Aghajanian , Robert J. Wiener , Steven D. Keck , John T. Burke , Peter M. Engelgau , Cheng-Tsin Lee , Michael A. Rocazella
CPC分类号: C04B35/652 , C22C1/1015 , C22C1/1036 , C22C47/06 , H01L21/4803 , H01L23/14 , H01L23/3733 , C22C2001/1063 , H01L2924/0002
摘要: The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.
摘要翻译: 本发明涉及通过自发渗透填充材料的可渗透物质或具有熔融基质金属的预成型体并将自发渗透的材料结合到至少一种第二材料如陶瓷或含陶瓷的体和/或 含金属或金属的物体。 特别地,渗透增强剂和/或渗透增强剂前体和/或渗透气氛至少在该过程中的某一点处与填料或预型体连通,这允许熔融基质金属自发地渗入填料或预型体。 此外,在渗透之前,将填料或预型体放置成与第二材料的至少一部分接触,使得在填充材料或预型体渗透之后,渗透的材料结合到第二材料,从而形成可密封的电子 包。
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