Fiber-optic gyroscope (FOG) assembly

    公开(公告)号:US11079230B2

    公开(公告)日:2021-08-03

    申请号:US16409375

    申请日:2019-05-10

    IPC分类号: G01C19/72

    摘要: One example includes a FOG assembly including a spool that includes a flattened portion corresponding to a flange comprising an axial center corresponding to a sensitive axis about which an associated FOG system is configured to measure rotation. The FOG assembly also includes a magnetic shield arranged as a capped concentric cover about the sensitive axis and coupled to the spool and the flange to create a toroidal cavity between the magnetic shield and the flange. A fiber coil is disposed within the toroidal cavity and coupled to the flange. The fiber coil includes an optical fiber which is counter-wound in first and second orientations. The fiber coil has an axial dimension along the sensitive axis that is less than or equal to approximately 160% of a radial width corresponding to a difference between an outer radius and an inner radius of the fiber coil.

    Calibration circuit to mitigate fiber-optic gyroscope (FOG) bias error

    公开(公告)号:US10989535B1

    公开(公告)日:2021-04-27

    申请号:US16778589

    申请日:2020-01-31

    摘要: One example includes a fiber-optic gyroscope (FOG) system that includes a fiber coil. The coil includes an optical fiber wound around a spool of a FOG. The optical fiber includes a first input and a second input. The system also includes an optical beam controller comprising an optical switch that provides a first optical beam to the first input and a second optical beam to the second input during a first switching state, and provides the first optical beam to the second input and the second optical beam to the first input during a second switching state. The system further includes a controller that mitigates bias error in determining rotation of the FOG based on comparing the first and second optical beams output from the FOG during the first and second switching states.

    Integrated optics chip with reduced thermal errors due to pyroelectric
effects
    4.
    发明授权
    Integrated optics chip with reduced thermal errors due to pyroelectric effects 失效
    集成光学芯片,由于热电效应而具有减少的热误差

    公开(公告)号:US6044184A

    公开(公告)日:2000-03-28

    申请号:US123955

    申请日:1998-07-28

    CPC分类号: G02F1/035 G02F2203/21

    摘要: An integrated optics chip with improved performance when exposed to changing temperature is disclosed. The optic chip or integrated optics chip or MIOC has a top surface, a +Z face and -Z face. The integrated optics chip is formed from a crystal substrate having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face, the Z axis being the axis across which a pyroelectric effect is exhibited. The top surface is orthogonal to the Z axis. An input waveguide on the top surface receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. A portion of the +Z and -Z faces are coated at least partially with a conductive coating. A conductive path couples the +Z and -Z faces to prevent a charge differential from developing between the +Z and -Z faces due to a change in temperature of the optic chip and the pyroelectric effect.

    摘要翻译: 公开了当暴露于变化的温度时具有改进的性能的集成光学芯片。 光学芯片或集成光学芯片或MIOC具有顶面,+ Z面和-Z面。 集成光学芯片由具有高电光系数的晶体衬底形成,例如铌酸锂。 为了将元件定向到要描述的光学芯片,+ Z晶体轴从+ Z面向外延伸,Z轴是表示热电效应的轴。 顶面与Z轴正交。 顶表面上的输入波导接收来自输入端口的光信号,将信号经由波导网络传递到将波导网络耦合到输出端口的输出波导。 至少部分地用导电涂层涂覆一部分+ Z和-Z面。 导电路径耦合+ Z和-Z面,以防止由于光学芯片的温度变化和热电效应而在+ Z和-Z面之间产生电荷差异。

    Dual purpose input electrode structure for MIOCs (multi-function
integrated optics chips)
    5.
    发明授权
    Dual purpose input electrode structure for MIOCs (multi-function integrated optics chips) 失效
    用于MIOC的双用途输入电极结构(多功能集成光学芯片)

    公开(公告)号:US6128424A

    公开(公告)日:2000-10-03

    申请号:US124457

    申请日:1998-07-28

    IPC分类号: G02B6/12 G02F1/035 G02F1/313

    摘要: An Integrated Optics Chip with improved performance when exposed to rapidly changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face. An input waveguide formed in the top surface of the chip and orthogonal to the +Z axis receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. Metalization is applied to the top face of the optic chip to form at least a first and a second rail. The first and second rails are positioned to very closely straddle a portion of the input waveguide. A conductive bridge connects the first and second rails to prevent a charge differential from developing between the first and second rails.

    摘要翻译: 公开了当暴露于快速变化的温度时具有改进的性能的集成光学芯片。 光学芯片或集成光学芯片或MIOC具有顶面,+ Z面和-Z面。 芯片由具有高电光系数的晶体形成,例如铌酸锂。 为了将组件定向到要描述的光学芯片,+ Z晶体轴从+ Z面向外延伸。 形成在芯片的顶表面并与+ Z轴正交的输入波导接收来自输入端口的光信号,将信号经由波导网络传递到将波导网络耦合到输出端口的输出波导。 将金属化施加到光学芯片的顶面以形成至少第一和第二导轨。 第一和第二轨道定位成非常紧密地跨越输入波导的一部分。 导电桥连接第一和第二导轨,以防止电荷差异在第一和第二导轨之间形成。