公开(公告)号：US06706553B2

公开(公告)日：2004-03-16

申请号：US09817710

申请日：2001-03-26

申请人： Steven Towle ,  John Cuendet ,  Kyle Johnson

发明人： Steven Towle ,  John Cuendet ,  Kyle Johnson

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2924/00

摘要： A microelectronic package including at least one microelectronic die disposed within an opening in a microelectronic package core, wherein a liquid encapsulation material is injected with a dispensing needle within portions of the opening not occupied by the microelectronic dice. The encapsulation material is cure thereafter. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic package core to form the microelectronic package.

摘要翻译： 一种微电子封装，其包括设置在微电子封装芯中的开口内的至少一个微电子管芯，其中液体封装材料在未被微电子管芯占据的部分开口内注射有分配针。 此后封装材料固化。 然后在微电子管芯，封装材料和微电子封装芯上制造介电材料和导电迹线的互连层以形成微电子封装。