-
1.发明授权公开(公告)号：US07205023B2
公开(公告)日：2007-04-17
申请号：US09891833
申请日：2001-06-25
CPC分类号： B01F15/0454 , Y10T137/87652
摘要： A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.
摘要翻译： 用于在单个晶片工艺中混合化学品的方法和设备。 根据本发明，化学品被供给到具有已知体积的管的阀系统中。 化学品被送入阀门系统中，用化学品填充管子以产生测量量的化学品。 然后在单个晶片工艺中使用测量的化学物质量。
-
公开(公告)号：US07819985B2
公开(公告)日：2010-10-26
申请号：US11497193
申请日：2006-07-31
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
-
公开(公告)号：US07836901B2
公开(公告)日：2010-11-23
申请号：US11977832
申请日：2007-10-26
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
摘要翻译： 一种用于湿处理单个晶片的设备，包括： 用于保持晶片的装置; 用于向晶片的非器件侧提供声能的装置; 以及用于将流体流动到晶片的装置侧的装置。
-
公开(公告)号：US20090026150A1
公开(公告)日：2009-01-29
申请号：US12284128
申请日：2008-09-17
CPC分类号： B01F15/0454 , Y10T137/87652
摘要： A method of and apparatus for mixing chemicals in a single wafer process. According to the present invention a chemical is fed into a valve system having a tube of a known volume. The chemical is fed into the valve system to fill the tube with a chemical to generate a measured amount of the chemical. The measured amount of chemical is then used in a single wafer process.
-
公开(公告)号：US20080314424A1
公开(公告)日：2008-12-25
申请号：US11977832
申请日：2007-10-26
IPC分类号： B08B13/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
-
公开(公告)号：US07334588B2
公开(公告)日：2008-02-26
申请号：US11496937
申请日：2006-07-31
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
-
公开(公告)号：US20090020144A1
公开(公告)日：2009-01-22
申请号：US12233504
申请日：2008-09-18
IPC分类号： B08B13/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , Y10S134/902
摘要： An apparatus for wet processing individual substrates comprising; a means for holding the substrate; a means for providing acoustic energy to a non-device side of the substrate; and a means for flowing a fluid onto a device side of the substrate.
摘要翻译： 一种用于湿处理单个基底的装置，包括： 用于保持基板的装置; 用于向基板的非器件侧提供声能的装置; 以及用于将流体流动到衬底的器件侧的装置。
-
公开(公告)号：US07451774B2
公开(公告)日：2008-11-18
申请号：US09891849
申请日：2001-06-25
IPC分类号： B08B3/12
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
摘要翻译： 一种用于湿处理单个晶片的设备，包括： 用于保持晶片的装置; 用于向晶片的非器件侧提供声能的装置; 以及用于将流体流动到晶片的装置侧的装置。
-
公开(公告)号：US20060260659A1
公开(公告)日：2006-11-23
申请号：US11496936
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Kelly Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Kelly Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
-
公开(公告)号：US20060260643A1
公开(公告)日：2006-11-23
申请号：US11497405
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
-
-
-
-
-
-
-
-
-
搜索结果
31 条记录 (耗时 0.033 秒)
