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1.
公开(公告)号:US11584081B2
公开(公告)日:2023-02-21
申请号:US17549315
申请日:2021-12-13
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/295 , B29C64/124 , B29C64/364 , B29C64/393 , B29C64/135 , B33Y50/02 , B33Y10/00 , B29C64/255 , B29C64/232 , B29C64/129 , B33Y40/00 , B33Y30/00
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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2.
公开(公告)号:US20230034915A1
公开(公告)日:2023-02-02
申请号:US17965685
申请日:2022-10-13
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/364 , B29C64/393 , B29C64/135 , B33Y50/02 , B29C64/295 , B33Y10/00 , B29C64/255 , B29C64/124 , B29C64/232 , B29C64/129 , B33Y40/00
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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3.
公开(公告)号:US11707891B2
公开(公告)日:2023-07-25
申请号:US17965685
申请日:2022-10-13
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/124 , B29C64/295 , B29C64/364 , B29C64/393 , B29C64/135 , B33Y50/02 , B33Y10/00 , B29C64/255 , B29C64/232 , B29C64/129 , B33Y40/00 , B33Y30/00
CPC classification number: B29C64/364 , B29C64/124 , B29C64/129 , B29C64/135 , B29C64/232 , B29C64/255 , B29C64/295 , B29C64/393 , B33Y10/00 , B33Y40/00 , B33Y50/02 , B33Y30/00 , G05B2219/49013
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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4.
公开(公告)号:US20220097304A1
公开(公告)日:2022-03-31
申请号:US17549315
申请日:2021-12-13
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/364 , B29C64/393 , B29C64/135 , B33Y50/02 , B29C64/295 , B33Y10/00 , B29C64/255 , B29C64/124 , B29C64/232
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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5.
公开(公告)号:US11498280B2
公开(公告)日:2022-11-15
申请号:US17066372
申请日:2020-10-08
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/393 , B29C64/295 , B29C64/364 , B29C64/135 , B33Y50/02 , B33Y10/00 , B29C64/255 , B29C64/124 , B29C64/232 , B29C64/129
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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6.
公开(公告)号:US11498279B2
公开(公告)日:2022-11-15
申请号:US17066249
申请日:2020-10-08
Applicant: Stratasys, Inc.
Inventor: Joel Ong , Christopher Prucha , Stephanie Benight , Bill Buel
IPC: B29C64/124 , B29C64/295 , B29C64/364 , B29C64/393 , B29C64/135 , B33Y50/02 , B33Y10/00 , B29C64/255 , B29C64/232 , B29C64/129
Abstract: A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
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