LASER BEAM MACHINING APPARATUS
    2.
    发明申请
    LASER BEAM MACHINING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号:US20090127233A1

    公开(公告)日:2009-05-21

    申请号:US12263310

    申请日:2008-10-31

    IPC分类号: B23K26/00

    摘要: A laser beam machining apparatus including a chuck table for holding a wafer, and a laser beam irradiation unit for irradiating the wafer held on the chuck table with a pulsed laser beam. The laser beam machining apparatus further includes a plasma detecting part which includes a plasma receiving part for receiving a plasma generated by irradiation of the work with the laser beam radiated from the laser beam irradiation unit, and a spectrum analyzing part for analyzing the spectrum of the plasma received by the plasma receiving part; and a controller for determining the material of the work on the basis of a spectrum analysis signal from the spectrum analyzing part of the plasma detecting part and for controlling the laser beam irradiation unit.

    摘要翻译: 一种激光束加工装置,包括用于保持晶片的卡盘台和激光束照射单元,用于用脉冲激光束照射保持在卡盘台上的晶片。 激光束加工装置还包括等离子体检测部件,其包括等离子体接收部件,用于接收由激光束照射单元辐射的激光束照射工件产生的等离子体;以及光谱分析部件,用于分析 由等离子体接收部接收的等离子体; 以及控制器,用于根据来自等离子体检测部分的光谱分析部分的光谱分析信号确定工件的材料并控制激光束照射单元。