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公开(公告)号：US20090127233A1
公开(公告)日：2009-05-21
申请号：US12263310
申请日：2008-10-31
IPC分类号： B23K26/00
CPC分类号： G01N21/73 , B23K26/032 , B23K26/0853 , G01J3/443 , G01N2021/8416 , G01N2201/0697 , H01L21/67253
摘要： A laser beam machining apparatus including a chuck table for holding a wafer, and a laser beam irradiation unit for irradiating the wafer held on the chuck table with a pulsed laser beam. The laser beam machining apparatus further includes a plasma detecting part which includes a plasma receiving part for receiving a plasma generated by irradiation of the work with the laser beam radiated from the laser beam irradiation unit, and a spectrum analyzing part for analyzing the spectrum of the plasma received by the plasma receiving part; and a controller for determining the material of the work on the basis of a spectrum analysis signal from the spectrum analyzing part of the plasma detecting part and for controlling the laser beam irradiation unit.
摘要翻译： 一种激光束加工装置，包括用于保持晶片的卡盘台和激光束照射单元，用于用脉冲激光束照射保持在卡盘台上的晶片。 激光束加工装置还包括等离子体检测部件，其包括等离子体接收部件，用于接收由激光束照射单元辐射的激光束照射工件产生的等离子体;以及光谱分析部件，用于分析 由等离子体接收部接收的等离子体; 以及控制器，用于根据来自等离子体检测部分的光谱分析部分的光谱分析信号确定工件的材料并控制激光束照射单元。
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公开(公告)号：US20090266800A1
公开(公告)日：2009-10-29
申请号：US12414975
申请日：2009-03-31
申请人： Hiroshi Morikazu , Keiji Honjo , Kenji Asano
发明人： Hiroshi Morikazu , Keiji Honjo , Kenji Asano
IPC分类号： B23K26/00
CPC分类号： B23K26/0853 , B23K26/0626 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method for a transparent plate having a predetermined breaking line including the step of applying a pulsed laser beam to the transparent plate along the breaking line to thereby form a laser processed groove. The pulsed laser beam has an absorption wavelength to the transparent plate. The repetition frequency of the pulsed laser beam is set to 200 kHz or more and the energy density per pulse of the pulsed laser beam is set to 3.8 J/cm2 or more.
摘要翻译： 一种具有预定断裂线的透明板的激光加工方法，包括沿着断裂线向脉冲激光束施加脉冲激光束，从而形成激光加工槽。 脉冲激光束具有到透明板的吸收波长。 将脉冲激光束的重复频率设定为200kHz以上，将脉冲激光的每脉冲的能量密度设定为3.8J / cm 2以上。
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公开(公告)号：US08513566B2
公开(公告)日：2013-08-20
申请号：US11979936
申请日：2007-11-09
申请人： Hiroshi Morikazu , Keiji Nomaru
发明人： Hiroshi Morikazu , Keiji Nomaru
CPC分类号： B23K26/0853 , B23K26/067 , B23K26/0673 , B23K26/082 , B23K2101/40
摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table and a processing-feed means, wherein the laser beam application means comprises a first pulse laser beam application means and a second pulse laser beam application means; the first pulse laser beam application means comprises an acousto-optic deflection means for deflecting the optical axis of a pulse laser beam oscillated by a first pulse laser beam oscillation means in the processing-feed direction (X direction), and a first condenser lens for converging a pulse laser beam passing through the acousto-optic deflection means; the second pulse laser beam application means comprises a second condenser lens for converging a pulse laser beam oscillated by the second pulse laser beam oscillation means; and an NA value of the first condenser lens is set smaller than the NA value of the second condenser lens.
摘要翻译： 一种激光束处理机，包括：激光束施加装置，用于将激光束施加到夹持在卡盘台上的工件;以及加工进给装置，其中所述激光束施加装置包括第一脉冲激光束施加装置和第二脉冲激光器 射束施加装置; 第一脉冲激光束施加装置包括用于使由第一脉冲激光束振荡装置在处理进给方向（X方向）上振荡的脉冲激光束的光轴偏转的声光偏转装置，以及用于 会聚通过声光偏转装置的脉冲激光束; 第二脉冲激光束施加装置包括用于会聚由第二脉冲激光束振荡装置振荡的脉冲激光束的第二聚光透镜; 并且将第一聚光透镜的NA值设定为小于第二聚光透镜的NA值。
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公开(公告)号：US07919725B2
公开(公告)日：2011-04-05
申请号：US11898505
申请日：2007-09-12
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： B23K26/38
CPC分类号： H01L21/76898 , B23K26/082 , B23K26/0853 , B23K26/16 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/02057 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads on each of the devices, by applying a laser beam from the rear surface side of the substrate, comprising the steps of forming an annular groove by applying a laser beam to an annular area surrounding a via hole forming area on the rear surface of the substrate; and forming a via hole reaching a bonding pad by applying a laser beam to the via hole forming area surrounded by the annular groove from the rear surface side of the substrate.
摘要翻译： 一种通过从衬底的后表面侧施加激光束，形成通孔到达衬底的接合焊盘的方法，所述接合焊盘具有衬底前表面上的多个器件和每个器件上的接合焊盘，该激光束包括 通过将激光束施加到围绕基板后表面上的通孔形成区域的环形区域来形成环形槽的步骤; 以及通过将激光束从所述基板的后表面侧的所述环形槽包围的通路孔形成区域形成到达焊盘的通孔。
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公开(公告)号：US07601616B2
公开(公告)日：2009-10-13
申请号：US11826911
申请日：2007-07-19
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。
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公开(公告)号：US20090197351A1
公开(公告)日：2009-08-06
申请号：US12363318
申请日：2009-01-30
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/0626 , B23K26/364 , B23K26/40 , B23K2103/50 , H01L21/78
摘要： In a laser beam processing method, when a laser beam is emitted along a second predetermined dividing line to form a second groove intersecting a first groove previously formed, the power output of the laser beam is allowed to be a first power output in a first interval, that is, until the second predetermined dividing line reaches a position immediately before the first groove. In a second interval from the position close to the first groove to the first groove reached by the second predetermined dividing line, the power output of the laser beam is set to a second power output lower than the first power output. Thus, overheat on the periphery of the second interval can be suppressed.
摘要翻译： 在激光束处理方法中，当沿着第二预定分割线发射激光束以形成与预先形成的第一凹槽相交的第二凹槽时，激光束的功率输出被允许为第一间隔中的第一功率输出 即，直到第二预定分割线到达紧接在第一凹槽之前的位置。 在从靠近第一凹槽的位置到由第二预定分割线到达的第一凹槽的位置的第二间隔中，激光束的功率输出被设置为低于第一功率输出的第二功率输出。 因此，可以抑制第二间隔的周边的过热。
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公开(公告)号：US07557904B2
公开(公告)日：2009-07-07
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
摘要翻译： 一种晶片保持机构，用于利用吸力将带有胶带的胶片固定在框架上。 晶片保持机构包括抽吸体，具有用于通过带保持晶片的保持表面的晶片保持器和具有设置在晶片保持器的外周边缘处的抽吸部分的抽吸单元。 抽吸部分穿过保持表面穿过晶片保持器的外周边缘传递吸力，使得当吸引部分被带覆盖和密封时，晶片保持器被保持在抽吸单元处，并且晶片保持在 保持表面。
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公开(公告)号：US20080299745A1
公开(公告)日：2008-12-04
申请号：US12110839
申请日：2008-04-28
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： H01L21/268 , H01L21/00
CPC分类号： H01L21/78 , B23K26/40 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D5/0011 , B28D5/023
摘要： A wafer separating method including a laminated member removing step for partially removing a laminated member of a wafer along streets by applying a laser beam to the wafer along the streets, and a cutting step for cutting a substrate of the wafer along the streets after the laminated member removing step. The laminated member removing step includes a first laser processing step for applying a first laser beam along two parallel lines spaced apart from each other in each street, the first laser beam being capable of passing through the laminated member and having an absorption wavelength to the substrate, thereby heating the substrate to generate two cracks in the laminated member by thermal shock so that the two cracks extend along the two parallel lines in each street; and a second laser processing step for applying a second laser beam to a region between the two cracks in the laminated member, the second laser beam having an energy density higher than that of the first laser beam, thereby removing the region between the two cracks in the laminated member to expose the substrate along each street.
摘要翻译： 一种晶片分离方法，包括：通过沿着街道向晶片施加激光而沿着街道部分地去除晶片的层叠构件的层叠构件去除步骤，以及在层叠之后沿着街道切割晶片的基板的切割步骤 成员删除步骤。 层叠构件除去步骤包括：第一激光加工步骤，用于沿着每个街道彼此间隔开的两条平行线施加第一激光束，第一激光束能够穿过层叠构件并具有到基板的吸收波长 从而加热基板，通过热冲击在层压部件中产生两个裂缝，使得两条裂缝沿着每条街道的两条平行线延伸; 以及第二激光加工步骤，用于将第二激光束施加到层叠部件中的两个裂纹之间的区域，第二激光束的能量密度高于第一激光束的能量密度，从而去除了两个裂纹之间的区域 层叠构件沿着每条街道露出基板。
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公开(公告)号：US07408129B2
公开(公告)日：2008-08-05
申请号：US11593045
申请日：2006-11-06
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。
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公开(公告)号：US20080179302A1
公开(公告)日：2008-07-31
申请号：US12007267
申请日：2008-01-08
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： B23K26/38
CPC分类号： B23K26/0734 , B23K26/40 , B23K2103/50 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads formed on each of the devices by applying a pulse laser beam from the rear surface side of the substrate, wherein when a pulse laser beam having a spot diameter which satisfies D/2≦d≦D−2 μm (wherein a diameter of the via hole to be formed is represented as D and a spot diameter of the pulse laser beam is represented as d) is applied in such a manner that the periphery of the spot moves along the inner circumference of the via hole to be formed, the pulse laser beam is applied at an angle of 120 to 180° from the previous application position.
摘要翻译： 一种通过从衬底的背面侧施加脉冲激光而形成在基板前表面上具有多个器件的晶片中的通孔到达每个器件上形成的接合焊盘的方法， 其中当具有满足D / 2 <= d <= D-2μm的点直径的脉冲激光束（其中要形成的通孔的直径表示为D并且表示脉冲激光束的光点直径 如d）所示的方式使得点的周边沿着要形成的通孔的内圆周移动，脉冲激光束以与先前的施加位置成120-180°的角度施加。
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