公开(公告)号：US07847300B2

公开(公告)日：2010-12-07

申请号：US12078250

申请日：2008-03-28

申请人： Sun-Hong Kim ,  Min-Sik Kim ,  Jin-Na Lee

发明人： Sun-Hong Kim ,  Min-Sik Kim ,  Jin-Na Lee

IPC分类号： H01L29/267

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.

摘要翻译： 公开了一种发光二极管封装。 发光二极管封装包括放置芯片的电极焊盘; 具有窗口的壳体，芯片暴露在该窗口中; 限定窗户的外壳壁; 以及从所述电极焊盘沿着所述壳体的方向延伸露出在所述壳体的表面外的电极引线，其中，沿所述方向形成的所述壳体壁包括第一部分和比所述第一部分更厚以覆盖所述电极的第二部分 铅。