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公开(公告)号:US20210408313A1
公开(公告)日:2021-12-30
申请号:US17356417
申请日:2021-06-23
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Tyler D. Newman , Paul W. Loscutoff , George G. Correos , Yafu Lin , Andrea R. Bowring , David C. Okawa , Matthew T. Matsumoto , Benjamin I. Hsia , Arbaz Ahmed Shakir , John H. Lippiatt , Simone I. Nazareth , Ryan Reagan , Todd R. Johnson , Ned Western , Tamir Lance , Marc Robinson
摘要: Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.
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公开(公告)号:US20190312166A1
公开(公告)日:2019-10-10
申请号:US16377074
申请日:2019-04-05
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , David C. Okawa , David F. Kavulak , Lewis C. Abra , George G. Correos , Richard Hamilton Sewell , Ryan Reagan , Tamir Lance , Thierry Nguyen
IPC分类号: H01L31/05 , H01L31/0224 , H01L31/068 , H01L31/18 , H02S40/34
摘要: A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.
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公开(公告)号:US20220158001A1
公开(公告)日:2022-05-19
申请号:US17589581
申请日:2022-01-31
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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公开(公告)号:US20190308270A1
公开(公告)日:2019-10-10
申请号:US16377077
申请日:2019-04-05
申请人: SunPower Corporation
IPC分类号: B23K26/22 , H01L31/18 , B23K26/00 , B23K26/02 , B23K26/08 , B23K26/10 , B23K26/06 , B23K26/16
摘要: A system for fabricating solar cells. The system including one or more of: a laser assisted metallization patterning unit adapted to expose a metal foil located over a substrate to a laser beam to form a conductive contact structure comprising a locally deposited metal on the substrate; a debris removal unit adapted to remove debris from a top surface of a metal foil that is attached to a top surface of a substrate; a carrier attachment unit adapted to attach a carrier to one the top surface of the metal foil; and a metal removal unit adapted to remove the carrier and at least a portion of the metal foil.
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公开(公告)号:US11276785B2
公开(公告)日:2022-03-15
申请号:US16377053
申请日:2019-04-05
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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公开(公告)号:US20190312163A1
公开(公告)日:2019-10-10
申请号:US16377000
申请日:2019-04-05
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC分类号: H01L31/0465 , H01L31/049 , H01L31/0475
摘要: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号:US20190312157A1
公开(公告)日:2019-10-10
申请号:US16377053
申请日:2019-04-05
申请人: SunPower Corporation
发明人: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要: A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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