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公开(公告)号：US11646387B2
公开(公告)日：2023-05-09
申请号：US16377074
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , David C. Okawa , David F. Kavulak , Lewis C. Abra , George G. Correos , Richard Hamilton Sewell , Ryan Reagan , Tamir Lance , Thierry Nguyen
IPC分类号： H01L31/05 , H01L31/0224 , H02S40/34 , H01L31/18 , H01L31/068
CPC分类号： H01L31/0516 , H01L31/02245 , H01L31/0682 , H01L31/182 , H02S40/34
摘要： A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.
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公开(公告)号：US11664472B2
公开(公告)日：2023-05-30
申请号：US16377000
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC分类号： H01L31/05 , H01L31/0224 , H01L31/0465 , H01L31/0475 , H01L31/049
CPC分类号： H01L31/0465 , H01L31/022433 , H01L31/049 , H01L31/0475 , H01L31/0508
摘要： Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号：US20220158001A1
公开(公告)日：2022-05-19
申请号：US17589581
申请日：2022-01-31
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要： A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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公开(公告)号：US20190312166A1
公开(公告)日：2019-10-10
申请号：US16377074
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , David C. Okawa , David F. Kavulak , Lewis C. Abra , George G. Correos , Richard Hamilton Sewell , Ryan Reagan , Tamir Lance , Thierry Nguyen
IPC分类号： H01L31/05 , H01L31/0224 , H01L31/068 , H01L31/18 , H02S40/34
摘要： A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.
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公开(公告)号：US11682737B2
公开(公告)日：2023-06-20
申请号：US17589581
申请日：2022-01-31
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
CPC分类号： H01L31/02008 , H01L31/18 , H01L31/1892 , H01L31/0516
摘要： A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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公开(公告)号：US11276785B2
公开(公告)日：2022-03-15
申请号：US16377053
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要： A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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公开(公告)号：US20190312163A1
公开(公告)日：2019-10-10
申请号：US16377000
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Marc Robinson , Paul W. Loscutoff , Ryan Reagan , David Okawa , Tamir Lance , Thierry Nguyen
IPC分类号： H01L31/0465 , H01L31/049 , H01L31/0475
摘要： Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.
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公开(公告)号：US20190312157A1
公开(公告)日：2019-10-10
申请号：US16377053
申请日：2019-04-05
申请人： SunPower Corporation
发明人： Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , Lewis C. Abra , George G. Correos , Boris Bastien
摘要： A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.
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