公开(公告)号：US20210408313A1

公开(公告)日：2021-12-30

申请号：US17356417

申请日：2021-06-23

申请人： SunPower Corporation

发明人： Pei Hsuan Lu ,  Tyler D. Newman ,  Paul W. Loscutoff ,  George G. Correos ,  Yafu Lin ,  Andrea R. Bowring ,  David C. Okawa ,  Matthew T. Matsumoto ,  Benjamin I. Hsia ,  Arbaz Ahmed Shakir ,  John H. Lippiatt ,  Simone I. Nazareth ,  Ryan Reagan ,  Todd R. Johnson ,  Ned Western ,  Tamir Lance ,  Marc Robinson

IPC分类号： H01L31/05 ,  H01L31/02 ,  H01L31/18 ,  H02S40/34

摘要： Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.

公开(公告)号：US11664472B2

公开(公告)日：2023-05-30

申请号：US16377000

申请日：2019-04-05

申请人： SunPower Corporation

发明人： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC分类号： H01L31/05 ,  H01L31/0224 ,  H01L31/0465 ,  H01L31/0475 ,  H01L31/049

CPC分类号： H01L31/0465 ,  H01L31/022433 ,  H01L31/049 ,  H01L31/0475 ,  H01L31/0508

摘要： Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

公开(公告)号：US20190312163A1

公开(公告)日：2019-10-10

申请号：US16377000

申请日：2019-04-05

申请人： SunPower Corporation

发明人： Pei Hsuan Lu ,  Benjamin I. Hsia ,  David Aaron Randolph Barkhouse ,  Lewis C. Abra ,  George G. Correos ,  Marc Robinson ,  Paul W. Loscutoff ,  Ryan Reagan ,  David Okawa ,  Tamir Lance ,  Thierry Nguyen

IPC分类号： H01L31/0465 ,  H01L31/049 ,  H01L31/0475

摘要： Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.