公开(公告)号：US20080146228A1

公开(公告)日：2008-06-19

申请号：US11587165

申请日：2005-04-22

申请人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

发明人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

IPC分类号： H04B7/26 ,  H04Q7/20

CPC分类号： H04W36/0066

摘要： Disclosed is a mobile communication system and method for packet hand-over between asynchronous communication network and synchronous communication network, and mobile communication terminal therefor for enabling a mobile phone to be connected with a synchronous network using a call re-sending message transmitted in an asynchronous network. The mobile communication system and method saves the time that a mobile phone, which performs a packet hand-over from an asynchronous network to a synchronous network, re-connects the synchronous network with a packet call, because the call re-sending message transmitted in an asynchronous network is provided to a multi mode multi band mobile phone in case that a hand-over is requested.

摘要翻译： 公开了一种用于异步通信网络和同步通信网络之间的分组交接的移动通信系统和方法，以及用于使移动电话与同步网络连接的移动通信终端，所述移动通信系统和方法使用以异步方式发送的呼叫重发消息 网络。 移动通信系统和方法节省了从异步网络向同步网络执行分组交换的移动电话将同步网络与分组呼叫重新连接的时间，因为呼叫重发消息在 在请求转交的情况下，向多模式多频带移动电话提供异步网络。

公开(公告)号：US07220163B2

公开(公告)日：2007-05-22

申请号：US11428813

申请日：2006-07-05

申请人： Sung-Ho Shin

发明人： Sung-Ho Shin

IPC分类号： B24B49/00

CPC分类号： B24B49/00 ,  B24B37/042 ,  B24B37/20 ,  B24B57/02

摘要： A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a polishing pad is measured during an initial stage and a first reference range of the thickness change of the slurry film is preferably set to determine a replacement time corresponding to the abrasion amount of the polishing pad. A conditioning condition of the polishing pad conditioning can also be set, and a second displacement of the semiconductor wafer with respect to the polishing pad can be measured when the surface of the semiconductor wafer is polished by the polishing pad. The first displacement is then preferably compared with the second displacement to calculate the thickness change of the slurry film formed between the polishing pad and the semiconductor wafer. When the thickness change of the slurry film is out of the first reference range, the polishing pad is preferably replaced. When the surface state of the polishing pad corresponding to the thickness change of the slurry film fails the conditioning condition, a conditioning operation to condition the surface of the polishing pad is preferably performed.

摘要翻译： 提供了一种用于在化学机械抛光操作中使用浆料膜的厚度变化来测量抛光垫的磨损量和摩擦力的方法和装置。 在优选的方法中，例如，在初始阶段测量半导体晶片相对于抛光垫的第一位移，并且优选设置浆料膜的厚度变化的第一参考范围，以确定对应于 抛光垫的磨损量。 还可以设置抛光垫调理的调理条件，并且当通过抛光垫抛光半导体晶片的表面时，可以测量半导体晶片相对于抛光垫的第二位移。 然后优选将第一位移与第二位移进行比较，以计算在抛光垫和半导体晶片之间形成的浆料膜的厚度变化。 当浆料膜的厚度变化超出第一基准范围时，优选更换抛光垫。 当与浆料膜的厚度变化相对应的抛光垫的表面状态在调理条件下失效时，优选进行调整抛光垫表面的调节操作。

公开(公告)号：US20090098804A1

公开(公告)日：2009-04-16

申请号：US12285852

申请日：2008-10-15

申请人： Jong-Heun Lim ,  Sung-Ho Shin ,  Bo-Un Yoon ,  Chang-Ki Hong

发明人： Jong-Heun Lim ,  Sung-Ho Shin ,  Bo-Un Yoon ,  Chang-Ki Hong

IPC分类号： B24B49/12 ,  B24B9/00 ,  B24B21/02

CPC分类号： B24B9/065 ,  B24B21/02 ,  B24B37/013 ,  B24B49/12

摘要： A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

摘要翻译： 晶片抛光装置包括在两个导辊之间延伸的研磨带，抛光带的与待抛光晶片的表面接触的第一表面，包括推动垫的抛光头，该推动垫适于将抛光带推向 要抛光的晶片的表面，邻近抛光带的彩色图像传感器，彩色图像传感器适于检测研磨带的彩色图像并输出与检测到的彩色图像相对应的信号，以及控制器，连接到 所述彩色图像传感器，所述控制器适于接收从彩色图像传感器输出的信号，并且确定由彩色图像传感器检测到的彩色图像的颜色何时改变指示抛光终点的彩色图像的变化。

公开(公告)号：US20080095111A1

公开(公告)日：2008-04-24

申请号：US10594465

申请日：2005-03-31

申请人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

发明人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

IPC分类号： H04Q7/00

CPC分类号： H04W52/50 ,  H04W36/14 ,  H04W52/287 ,  H04W52/36 ,  H04W52/38 ,  H04W52/40

摘要： Disclosed are a method for hand-over between an asynchronous communication network and a synchronous communication network of multi mode multi band mobile communication terminal and mobile communication terminal therefor to improve the hand-over connecting rate between an asynchronous communication network and a synchronous communication network in a mixed mobile communication system of an asynchronous network and a synchronous network.

摘要翻译： 本发明公开了一种异步通信网络与多模式多频带移动通信终端的同步通信网络之间切换的方法及其移动通信终端，用于提高异步通信网络与同步通信网络之间的切换连接速率 异步网络和同步网络的混合移动通信系统。

公开(公告)号：US20070258405A1

公开(公告)日：2007-11-08

申请号：US10585303

申请日：2005-01-05

申请人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

发明人： Young-Lak Kim ,  Sung-Ho Shin ,  Jong-Tae Ihm

IPC分类号： H04Q7/00

CPC分类号： H04W36/0066

摘要： A handover method for a mobile communication terminal is disclosed. In the handover method, a radio network controller periodically measures the wireless environment of a mobile communication terminal, determines whether handover is required, and informs the asynchronous mobile switching center of the asynchronous communication system that the handover is required. The asynchronous mobile switching center requests the handover and a synchronous mobile switching center assigns a forward channel to the mobile communication terminal. The mobile communication terminal prepares for communication with a synchronous mobile communication system according to the direction of the asynchronous mobile switching center, and causes a backward channel with respect to the synchronous communication system to be assigned to the mobile communication terminal. The synchronous mobile switching center informs the asynchronous mobile switching center that handover has been completed, and causes a connection between the asynchronous mobile switching center and the radio network controller to be released.

摘要翻译： 公开了一种用于移动通信终端的切换方法。 在切换方法中，无线网络控制器周期性地测量移动通信终端的无线环境，确定是否需要切换，并且通知异步通信系统的异步移动交换中心需要切换。 异步移动交换中心请求切换，并且同步移动交换中心向移动通信终端分配前向信道。 移动通信终端根据异步移动交换中心的方向准备与同步移动通信系统的通信，并且使相对于同步通信系统的反向信道被分配给移动通信终端。 同步移动交换中心通知异步移动交换中心切换已经完成，并使得异步移动交换中心与无线网络控制器之间的连接被释放。

公开(公告)号：US20070015442A1

公开(公告)日：2007-01-18

申请号：US11428813

申请日：2006-07-05

申请人： Sung-Ho Shin

发明人： Sung-Ho Shin

IPC分类号： B24B49/00 ,  B24B7/30 ,  B24B1/00

CPC分类号： B24B49/00 ,  B24B37/042 ,  B24B37/20 ,  B24B57/02

摘要： A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a polishing pad is measured during an initial stage and a first reference range of the thickness change of the slurry film is preferably set to determine a replacement time corresponding to the abrasion amount of the polishing pad. A conditioning condition of the polishing pad conditioning can also be set, and a second displacement of the semiconductor wafer with respect to the polishing pad can be measured when the surface of the semiconductor wafer is polished by the polishing pad. The first displacement is then preferably compared with the second displacement to calculate the thickness change of the slurry film formed between the polishing pad and the semiconductor wafer. When the thickness change of the slurry film is out of the first reference range, the polishing pad is preferably replaced. When the surface state of the polishing pad corresponding to the thickness change of the slurry film fails the conditioning condition, a conditioning operation to condition the surface of the polishing pad is preferably performed.

公开(公告)号：US08015839B2

公开(公告)日：2011-09-13

申请号：US11995918

申请日：2006-07-25

申请人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

发明人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

IPC分类号： F25D17/04

CPC分类号： F25D17/065 ,  F25D2317/061 ,  F25D2317/0663

摘要： The present invention relates to a cool air supply structure of a storage receptacle for a refrigerator. The present invention comprises one or more box casings detachably installed in a refrigerating chamber, each box casing having a mounting space and a channel through which cool air flows, the cool air being supplied from a cool air supply source through a cool air supply port formed in a side surface of the refrigerating chamber; and one or more storage receptacles, each storage receptacle being withdrawably installed in the mounting space, wherein food accommodated in an accommodation space provided in the storage receptacle is indirectly cooled by the cool air that flows through the channel. According to the present invention, there is an advantageous effect in that the food accommodated in a plurality of storage receptacles can be stored to be fresher by indirectly cooling the food and simultaneously the supply of cool air can be controlled depending on the use or not of the storage receptacles.

摘要翻译： 本发明涉及一种用于冰箱的储存容器的冷气供应结构。 本发明包括一个或多个可拆卸地安装在冷藏室中的盒壳体，每个箱体壳体具有安装空间和冷气流过的通道，冷空气通过形成的冷空气供应口从冷空气供应源供应 在冷藏室的侧表面中; 和一个或多个存储插座，每个存储容器可抽出地安装在安装空间中，其中容纳在设置在存储容器中的容纳空间中的食物被流过通道的冷空气间接冷却。 根据本发明，有利的效果在于，容纳在多个储存容器中的食物可以通过间接冷却食物而被储存以更新鲜，并且可以根据使用情况来控制冷空气的供应 存放容器。

公开(公告)号：US20080196440A1

公开(公告)日：2008-08-21

申请号：US11995918

申请日：2006-07-25

申请人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

发明人： Byeong-Gyu Kang ,  Sung-Ho Shin ,  Young-Woo Kim ,  Jong-Suk Yoon ,  Yoon-Seok Bang ,  Jong-Wook An ,  Sang-Ho Park

IPC分类号： F25D17/08 ,  F25D17/00 ,  F25D17/06

CPC分类号： F25D17/065 ,  F25D2317/061 ,  F25D2317/0663

摘要： The present invention relates to a cool air supply structure of a storage receptacle for a refrigerator. The present invention comprises one or more box casings detachably installed in a refrigerating chamber, each box casing having a mounting space and a channel through which cool air flows, the cool air being supplied from a cool air supply source through a cool air supply port formed in a side surface of the refrigerating chamber; and one or more storage receptacles, each storage receptacle being withdrawably installed in the mounting space, wherein food accommodated in an accommodation space provided in the storage receptacle is indirectly cooled by the cool air that flows through the channel. According to the present invention, there is an advantageous effect in that the food accommodated in a plurality of storage receptacles can be stored to be fresher by indirectly cooling the food and simultaneously the supply of cool air can be controlled depending on the use or not of the storage receptacles.

摘要翻译： 本发明涉及一种用于冰箱的储存容器的冷气供应结构。 本发明包括一个或多个可拆卸地安装在冷藏室中的盒壳体，每个箱体壳体具有安装空间和冷气流过的通道，冷空气通过形成的冷空气供应口从冷空气供应源供应 在冷藏室的侧表面中; 和一个或多个存储插座，每个存储容器可抽出地安装在安装空间中，其中容纳在设置在存储容器中的容纳空间中的食物被流过通道的冷空气间接冷却。 根据本发明，有利的效果在于，容纳在多个储存容器中的食物可以通过间接冷却食物而被储存以更新鲜，并且可以根据使用情况来控制冷空气的供应 存放容器。

公开(公告)号：US20080037470A1

公开(公告)日：2008-02-14

申请号：US11576849

申请日：2005-01-04

申请人： Young-Lak Kim ,  Sung-Ho Shin ,  Hyun-Wook Kim ,  Jong-Tae Ihm

发明人： Young-Lak Kim ,  Sung-Ho Shin ,  Hyun-Wook Kim ,  Jong-Tae Ihm

IPC分类号： H04Q7/00

CPC分类号： H04W36/14

摘要： The handover method includes the steps of the base stations of the synchronous mobile communication network transmitting dummy pilot signals for the asynchronous mobile communication network, the mobile communication terminal, for which call connection with the asynchronous mobile communication network is performed through the asynchronous wireless device, determining whether the dummy pilot signals for the asynchronous mobile communication network have been received through the asynchronous wireless device; the mobile communication terminal requesting handover from the asynchronous mobile communication network if it is determined that the dummy pilot signals for the asynchronous mobile communication network have been received; and the asynchronous mobile communication network determining that handover is possible, notifying the mobile communication terminal of the determination that handover is possible, and the asynchronous mobile communication network requesting handover to the synchronous mobile communication network, thus performing handover.

摘要翻译： 切换方法包括以下步骤：同步移动通信网络的基站发送用于异步移动通信网络的虚拟导频信号，移动通信终端，其通过异步无线设备执行与异步移动通信网络的呼叫连接， 确定异步移动通信网络的虚拟导频信号是否已经通过异步无线设备接收; 如果确定已经接收到用于异步移动通信网络的虚拟导频信号，则移动通信终端请求从异步移动通信网络的切换; 并且异步移动通信网络确定切换是可能的，向移动通信终端通知可能进行切换的确定以及请求切换到同步移动通信网络的异步移动通信网络，从而执行切换。

公开(公告)号：US20070184663A1

公开(公告)日：2007-08-09

申请号：US11702124

申请日：2007-02-05

申请人： Jun-Yong Kim ,  Ho-Young Kim ,  Chang-Ki Hong ,  Bo-Un Yoon ,  Sung-Ho Shin

发明人： Jun-Yong Kim ,  Ho-Young Kim ,  Chang-Ki Hong ,  Bo-Un Yoon ,  Sung-Ho Shin

IPC分类号： H01L21/461 ,  H01L21/302

CPC分类号： H01L21/31053

摘要： Example embodiments are directed to a method of planarizing a semiconductor device. A first CMP process may be performed on an insulating layer to remove a stepped structure of the insulating layer. A second CMP process may be performed to planarize the insulating layer with the stepped structure removed until a given pattern is exposed. A process temperature of the first CMP process may be higher than that of the second CMP process. Accordingly, an initial stepped structure may be more readily removed in a planarization process of a surface of the semiconductor device, which may reduce the CMP process time and may increase the degree of planarization.

摘要翻译： 示例性实施例涉及一种平面化半导体器件的方法。 可以在绝缘层上执行第一CMP工艺以去除绝缘层的阶梯状结构。 可以执行第二CMP工艺以使去除直到给定图案暴露的阶梯结构的绝缘层平坦化。 第一CMP工艺的工艺温度可以高于第二CMP工艺的工艺温度。 因此，可以在半导体器件的表面的平坦化处理中更容易地去除初始阶梯结构，这可以减少CMP处理时间并且可以增加平坦化程度。